Light emitting diode package with protective function against electrostatic discharge

• US 7,326,964 B2
• Filed: 12/21/2005
• Issued: 02/05/2008
• Est. Priority Date: 03/23/2005
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Ho Joon, Lim, Chang Hyun, Lee, Sung Jun, Choi, Seog Moon, Choi, Sang Hyun, Hwang, Woong Lin
• Primary Examiner(s): Phung; Anh
• Assistant Examiner(s): BERNSTEIN, ALLISON
• Application Number:
  US11/312,365
• Publication Number:
  US 20060214181A1
• Time in Patent Office: 776 Days
• Field of Search: 257/100, 257/79, 257/84, 257/415, 361/91.5, 361/102
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

Claims

1. A Light Emitting Diode (LED) package having a protective function against electrostatic discharge comprising:

a submount with first and second electrode patterns formed thereon;

an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and

an MEMS switch including a first conductive plate disposed on the submount and a second conductive plate disposed apart from the first conductive plate on the submount and bent to have an area over and vertically apart from the first conductive plate, wherein the first conductive plate is electrically connected to one of the first and second electrode patterns, and the second conductive plate is electrically connected to the other electrode pattern, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

2. The LED package according to claim 1, wherein the submount comprises a silicon substrate and a SiO₂ film formed on the silicon substrate.

3. The LED package according to claim 2, wherein the first and second conductive plates are integrally formed with the submount, and electrically connected to the first and second electrode patterns, conductive patterns on the submount, respectively.

4. The LED package according to claim 1 or 3, wherein the submount further comprises conductive patterns formed on the submount, electrically connecting the first conductive plate to one of the first and second electrode patterns and electrically connecting the second conductive plate to the other electrode pattern.

5. The LED package according to claim 1, wherein the first and second conductive plates are made of metal.

6. The LED package according to claim 5, wherein the first and second conductive plates are made of Al.

7. The LED package having according to claim 1, wherein the second conductive plate is made of poly-silicon.

8. The LED package according to claim 1, wherein the predetermined level of voltage is up to 30V.

9. The LED package according to claim 1, further comprising a reflector formed around the LED on the submount for reflecting the light emitted from the LED upward.