Integrally packaged imaging module

• US 7,329,861 B2
• Filed: 10/14/2003
• Issued: 02/12/2008
• Est. Priority Date: 10/14/2003
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Afshari, Bahram, Ma, Guolin
• Primary Examiner(s): Epps; Georgia
• Assistant Examiner(s): Ko; Tony
• Application Number:
  US10/684,619
• Publication Number:
  US 20050077458A1
• Time in Patent Office: 1,582 Days
• Field of Search: 250/239, 257433-440, 257/59, 257678-680, 257/666, 257/676, 257/686, 257/777, 438106-110, 438 64- 70
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05024 the internal layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.

Claims

1. An integrally packaged imaging module, comprising:

an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;

a first adhesive layer located on at least a portion of a top surface of the semiconductor substrate;

a first spacing structure having a first height, the first spacing structure affixed to the semiconductor structure using the first adhesive layer;

a lens assembly located on at least a portion of a top surface of the first spacing structure, the lens assembly providing a second spacing structure;

a transparent enclosure portion having a surface area extending substantially to the periphery of the second spacing structure, the transparent enclosure portion disposed on top of the second spacing structure defining a cavity above the image sensing device of the IC, the cavity having a cavity height that is substantially equal to the first and second heights of the first and second spacing structures, and

the lens assembly includes a lens, wherein only the lens is disposed in the cavity.

2. The integrally packaged imaging module of claim 1, wherein the transparent enclosure portion includes material having infra-red filtering properties, wherein the desired range of wavelengths consists of wavelengths shorter than a cutoff wavelength associated with the infra-red filtering material.

3. The integrally packaged imaging module of claim 1, wherein the transparent enclosure portion includes a lens optically coupled with a multiplicity of pixels of the image sensing device.

4. The integrally packaged imaging module of claim 1, further comprising a lens support separate from the spacing structure and affixed to a top surface of the transparent enclosure portion, the lens support configured to support a lens over the transparent enclosure portion.

5. The integrally packaged imaging module of claim 4, wherein the lens support and the lens are preassembled into a lens assembly.

6. The integrally packaged imaging module of claim 1, wherein the spacing structure includes a set of four non-contiguous pieces surrounding a perimeter of the IC.

7. An integrally packaged imaging module, comprising:

an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;

wafer-level packaging enclosing the IC and formed at a semiconductor wafer level when the IC is positioned on a semiconductor wafer, and including;

a packaging substrate, wherein the semiconductor substrate is positioned over the packaging substrate and extends over substantially an entire top surface of the packaging substrate;

a transparent enclosure portion extending over substantially an entire top surface of the packaging substrate and adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths;

a first lens support adapted to suspend a first lens so that the first lens directs the image onto the image sensing device;

a first spacing structure adapted to provide a spacing between the suspended first lens and the image sensing device;

a second spacing structure, formed by the first lens support, positioned on top of the first spacing structure;

the transparent enclosure portion positioned on top of the second spacing structure;

the semiconductor substrate, the first and second spacing structures, and the transparent enclosure portion forming a single cavity; and

the first lens is disposed in the single cavity.

8. The integrally packaged imaging module of claim 7 wherein the transparent enclosure portion prevents unwanted wavelengths from illuminating the image sensing device.

9. The integrally packaged imaging module of claim 7, wherein the first spacing structure is configurable during assembly of the integrally packaged imaging module to achieve a desired focus of the image onto the image sensing device.

10. The integrally packaged imaging module of claim 7, wherein the first spacing structure is a part of the first lens support.

11. The integrally packaged imaging module of claim 7, wherein a thickness of a packaging layer is configurable during fabrication of the integrally packaged imaging module to achieve a desired focus of the image directed onto the image sensing device.

12. The integrally packaged imaging module of claim 7, wherein the first lens support is preassembled with the first lens into a first lens assembly.

13. The integrally packaged imaging module of claim 7, wherein the wafer-level packaging further includes a second lens support coupled to the first lens support, the second lens support adapted to suspend a second lens so that the second lens directs the image onto the image sensing device through the first lens.