Sensor module

• US 7,331,212 B2
• Filed: 01/09/2006
• Issued: 02/19/2008
• Est. Priority Date: 01/09/2006
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (Aptiv PLC)
• Inventors: Manlove, Gregory J., Long, Stephen P., Hawes, Kevin J., Borzabadi, Hamid R., Vas, Timothy A.
• Primary Examiner(s): Lefkowitz; Edward
• Assistant Examiner(s): Kirkland, III; Freddie
• Application Number:
  US11/328,032
• Publication Number:
  US 20070157699A1
• Time in Patent Office: 771 Days
• Field of Search: 73/120.1, 735/040.3, 735/040.4, 735/11, 737/78, 738/04, 738/05, 738/622.6
• US Class Current: 73/12.01
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01P 1/023 for acceleration measuring devices

Abstract

A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Claims

1. A sensor module comprising:

a housing;

a low temperature co-fired ceramic substrate located on the housing;

a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor;

a second sensor located on a low temperature co-fired ceramic substrate, wherein the second sensor comprises an accelerometer;

signal processing circuitry located on the low temperature co-fired ceramic substrate; and

a metal shield substantially encapsulating at least one of the first and second sensors.

2. The sensor module as defined in claim 1, wherein the metal shield comprises a first metal can overlying at least one of the first and second sensors on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.

3. The sensor module as defined in claim 2, wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.

4. The sensor module as defined in claim 1, wherein the signal processing circuitry comprises an ASIC.

5. The sensor module as defined in claim 1, wherein the first sensor is formed on a first low temperature co-fired ceramic substrate arid has the first metal shield, and the second sensor is located on a second low temperature co-fired ceramic substrate and has a second metal shield.

6. The sensor module as defined in claim 1, wherein the sensor is a vehicle crash sensor.

7. A vehicle crash sensor comprising:

a housing;

a low temperature co-fired ceramic substrate located on the housing;

a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor;

a second sensor located on a low temperature co-fired ceramic substrate, said second sensor comprising an accelerometer;

signal processing circuitry located on the low temperature co-fired ceramic substrate; and

a metal shield on the low temperature co-fired ceramic substrate and substantially encapsulating at least one of the first and second sensors.

8. The sensor module as defined in claim 7, wherein the metal shield comprises a first metal can overlying at least one of the first and second sensors on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.

9. The sensor module as defined in claim 8, wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.

10. The sensor module as defined in claim 7, wherein the signal processing circuitry comprises an ASIC.

11. The sensor module as defined in claim 7, wherein the first sensor is formed on a first low temperature co-fired ceramic substrate and has the first metal shield, and the second sensor is located on a second low temperature co-fired ceramic substrate and has second metal shield.