Apparatus and methods for the detection of an arc in a plasma processing system

• US 7,334,477 B1
• Filed: 12/22/2004
• Issued: 02/26/2008
• Est. Priority Date: 12/22/2004
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Pirkle, David
• Primary Examiner(s): Williams; Hezron
• Assistant Examiner(s): Miller; Rose M
• Application Number:
  US11/023,174
• Time in Patent Office: 1,161 Days
• Field of Search: 735/79, 735/87
• US Class Current: 73/587
• CPC Class Codes: H01J 2237/0206 Extinguishing, preventing or controlling unwanted discharges
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

In a plasma processing system, a method for detecting an arc event on a substrate in a plasma chamber having a chuck is disclosed. The method includes positioning a substrate on the chuck. The method also includes providing a vibration-sensing arrangement in the plasma chamber, the vibration-sensing arrangement being configured for measuring arc-induced vibrations on the substrate, the arc-induced vibrations being generated when an arc strikes the substrate during plasma processing of the substrate in the plasma processing chamber.

Claims

1. In a plasma processing system, a method for detecting an arc event on a substrate in a plasma chamber having a chuck, comprising:

positioning a substrate on said chuck;

providing a vibration-sensing arrangement in said plasma chamber, said vibration-sensing arrangement being configured for measuring arc-induced vibrations on said substrate to detect said arc event on said substrate, said arc-induced vibrations being generated when an arc strikes said substrate during plasma processing of said substrate in said plasma processing chamber, wherein said vibration-sensing arrangement is a contact sensing arrangement, at least a component or said vibration-sensing arrangement physically contacts a portion of said substrate; and

providing a result of said arc event to an operator.

2. The method of claim 1 further comprising providing a sensor configured to convert said arc-induced vibrations transmitted through said component to an electrical signal.

3. The method of claim 2 further comprising providing an amplifier and a computer device, said amplifier being configured to convert said electrical signal to an amplified signal, said computer being configured to analyze said amplified signal to detect when said arc strikes said substrate.

4. The method of claim 2 further comprising providing a computer device configured to analyze said electrical signal to detect when said arc strikes said substrate.

5. The method of claim 2 wherein said component is a rod.

6. The method of claim 5 wherein said rod is configured to contact an underside of said substrate, said underside of said substrate representing a chuck-contacting side of said substrate.

7. The method of claim 5 wherein said rod is configured to contact a side of said substrate, said side of said substrate representing a side that is perpendicular to said chuck-contacting side of said substrate.

8. The method of claim 5 wherein said rod is configured to contact a top of said substrate, said top of said substrate representing a side that is opposite and parallel to said chuck-contacting side of said substrate.

9. The method of claim 5 wherein said rod is disposed in an aperture in said chuck.

10. The method of claim 9 wherein said rod is biased against said underside of said substrate using a lossy biasing arrangement, said lossy biasing arrangement being configured to substantially isolate vibrations from other components of said plasma chamber, other than from said substrate, from said rod.

11. The method of claim 10 wherein said lossy biasing arrangement is a spring coupled to said rod.

12. The method of claim 10 wherein said lossy biasing arrangement is a resilient material coupled to said rod.

13. The method of claim 10 wherein said resilient material is one of plastic and rubber.

14. An apparatus for detecting an arc event in a plasma processing chamber, including a chuck configured to support a substrate during plasma processing, comprising:

a vibration-sensing arrangement in said plasma chamber, said vibration-sensing arrangement being configured for measuring arc-induced vibrations on said substrate to detect said arc event on said substrate, said arc-induced vibrations being generated when an arc strikes said substrate during plasma processing of said substrate in said plasma processing chamber, wherein said vibration-sensing arrangement is a contact sensing arrangement, at least a component of said vibration-sensing arrangement physically contacts a portion of said substrate.

15. The apparatus of claim 14 further comprising providing a sensor configured to convert said arc-induced vibrations transmitted through said component to an electrical signal.

16. The apparatus of claim 15 further comprising an amplifier and a computer device, said amplifier being configured to convert said electrical signal to an amplified signal, said computer being configured to analyze said amplified signal to detect when said arc strikes said substrate.

17. The apparatus of claim 15 further comprising a computer device configured to analyze said electrical signal to detect when said arc strikes said substrate.

18. The apparatus of claim 15 wherein said component is a rod.

19. The apparatus of claim 18 wherein said rod is configured to contact an underside of said substrate, said underside of said substrate representing a chuck-contacting side of said substrate.

20. The apparatus of claim 18 wherein said rod is configured to contact a side of said substrate, said side of said substrate representing a side that is perpendicular to said chuck-contacting side of said substrate.

21. The apparatus of claim 18 wherein said rod is configured to contact a top of said substrate, said top of said substrate representing a side that is opposite and parallel to said chuck-contacting side of said substrate.

22. The apparatus of claim 18 wherein said rod is disposed in an aperture in said chuck.

23. The apparatus of claim 22 wherein said rod is biased against said underside of said substrate using a lossy biasing arrangement, said lossy biasing arrangement being configured to substantially isolate vibrations from other components of said plasma chamber, other than from said substrate, from said rod.

24. The apparatus of claim 23 wherein said lossy biasing arrangement is a spring coupled to said rod.

25. The apparatus of claim 23 wherein said lossy biasing arrangement is a resilient material coupled said rod.

26. The apparatus of claim 23 wherein said resilient material is one of plastic and rubber.