Multi-layered transducer array and method for bonding and isolating

• US 7,344,501 B1
• Filed: 02/28/2001
• Issued: 03/18/2008
• Est. Priority Date: 02/28/2001
• Status: Active Grant

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Inventors: Mohr, John P. III, Walters, Worth B., Ayter, Sevig
• Primary Examiner(s): Jaworski; Francis J.
• Application Number:
  US09/796,411
• Time in Patent Office: 2,575 Days
• Field of Search: 600437-472, 310/334, 310/336, 310363-364, 29/253.5
• US Class Current: 600/459
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements include one or more of: (1) multiple-layer, multiple-dimensional arrays where the layers are polymericly bonded together and electrically connected through asperity contact, (2) multiple layer array of elements where air or gas separates at least two elements, (3) an even number of layers where each layer is electrically connected through asperity contact, (4) multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Claims

1. In a multi-layered transducer array, an improvement comprising at least one element including at least two layers of transducer material;

at least one kerf extending through a first of the at least two layers and into a second of the at least two layers within each element of the at least one element, the kerf electrically isolating two electrodes of different polarities associated with the two layers of each element of the at least one element,

wherein each element of the at least one element comprises a single mechanical element structure.

2. The transducer of claim 1 wherein each of the layers comprising at least a majority and a minority electrode on both of top and bottom surfaces, the majority and minority electrode on a common surface between two layers isolated by the kerf.

3. The transducer of claim 1 wherein the kerf comprises a cut extending from a first azimuthal edge to a second azimuthal edge of an element.

4. The transducer of claim 1 wherein the at least two layers comprises at least three layers, and further comprising a second kerf extending through a third layer different than the first layer into one of a fourth layer or the second layer, the kerf electrically isolating two electrodes associated with the third layer.

5. The transducer of claim 1 wherein the transducer material comprises piezoelectric material.

6. The transducer of claim 1 wherein the at least two layers are electrically joined by asperity contact.

7. The transducer of claim 1 wherein the transducer comprises a single one-dimensional array of elements.

8. The transducer of claim 1 wherein the transducer comprises a multi-dimensional array of elements.

9. The transducer of claim 8 wherein at least two elevationally spaced elements are separated by air.

10. The transducer of claim 8 comprising a partially manufactured transducer wherein at least two elevationally spaced elements are separated by a partial through cut and held relative to each other by an uncut bridge of transducer material.

11. The transducer of claim 1 wherein the layers comprise at least two layers of equal thickness in the range dimension.

12. The transducer of claim 1 wherein a thickness along a range dimension of the element varies.

13. The transducer of claim 1 wherein a first electrical lead from an ultrasound system is adjacent to a top layer of the layers and a second electrical lead from the ultrasound system is adjacent to a bottom layer of the layers.

14. The transducer of claim 1 wherein each element comprises an even number of layers of transducer material.

15. The transducer of claim 1 wherein each of the layers comprises at least two electrodes separated by two discontinuities, a configuration of the at least two electrodes and two discontinuities being substantially the same for each layer.

16. The transducer of claim 1 wherein the kerf extends through the first layer and only partially into the second of the at least two layers.

17. A method for manufacturing a multi-layered transducer array, the method comprising the acts of:

(a) stacking at least two layers of transducer material;

(b) bonding the stacked layers; and

(c) dicing into two layers of the stacked layers after (b), the dicing being within each element of at least one element of the array;

wherein (c) electrically isolates two electrodes of different polarities associated with each of the two layers of each element of the at least one element, and the array being without non-electrode based electrical interconnection of a plurality of elements.

18. The method of claim 17 further comprising:

(d) assembling the transducer with the stacked layers, the transducer comprising a multi-dimensional array of elements; and

(e) separating first and second elevationally adjacent elements of the assembled stacked transducer with air.

19. The method of claim 17 further comprising:

(d) cutting through a first layer of transducer material along only a portion of an azimuth width of the first layer.

20. The method of claim 17 further comprising:

(d) connecting a first electrical lead from an ultrasound system adjacent to a top layer of the layers; and

(e) connecting a second electrical lead from the ultrasound system adjacent to a bottom layer of the layers.

21. The method of claim 17 further comprising:

(d) stacking only an even number of layers of transducer material.

22. The method of claim 17 further comprising:

(d) configuring the layers with at least two electrodes and two discontinuities substantially the same for each layer.

23. The method of claim 17 further comprising:

(d) providing at least a majority and a minority electrode on both of top and bottom surfaces of each of the layers.

24. The method of claim 17 further comprising:

(d) electrically connecting first and second layers with asperity contact.

25. The method of claim 17 further comprising:

(d) dicing through a different combination of two layers of the stacked layers after (b);

wherein (d) electrically isolates two electrodes associated with each of the two layers.

26. The method of claim 17 wherein (c) comprises dicing from one azimuthal edge to another azimuthal edge of the layers of an element.

27. The method of claim 17 wherein (c) comprises dicing completely through a first layer of the two layers and only partially into a second layer of the two layers.