Wafer level packaging for optoelectronic devices

• US 7,345,316 B2
• Filed: 10/24/2001
• Issued: 03/18/2008
• Est. Priority Date: 10/25/2000
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Sherrer, David W., Dautargas, Mindaugus F., Ricks, Neil, Steinberg, Dan A.
• Primary Examiner(s): Smith; Zandra V.
• Assistant Examiner(s): Tran; Thanh Y.
• Application Number:
  US09/999,517
• Publication Number:
  US 20040264866A1
• Time in Patent Office: 2,337 Days
• Field of Search: 257/678, 257/684, 257/686, 257/687, 257/704, 257/707, 257/710, 257 98- 99, 257/690, 257/698, 257/729, 257/79, 257/432, 257/435, 257/E31.127, 385 53- 94, 385/49
• US Class Current: 257/98
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/421 the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4243 Mounting of the optical light guide into a groove mounting optical light guides into a groove in general G02B6/3636
• CPC Class Codes: G02B 6/4251 Sealed packages G02B6/4248 takes precedence

Abstract

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.

Claims

1. An optical device package comprising:

a) a substrate having an upper surface, a distal end, a proximal end, and at least one longitudinally extending notch;

b) a frame mounted to the substrate the frame including a band-like member surrounding an open area and having at least one recessed portion; and

,

c) at least one optical fiber positioned within the at least one longitudinally extending notch and disposed through the recessed portion of the frame.

2. The optical device package of claim 1 wherein the at least one longitudinally extending notch comprises distal and proximal longitudinally extending notches.

3. The optical device package of claim 2 further comprising an optical semiconductor component mounted to the substrate.

4. The optical device package of claim 3 further comprising a lid mounted to the frame for enclosing the optical semiconductor component in an interior space.

5. The optical device package of claim 3 further comprising one or more optical device selected from the group consisting of a lens, filter and modulator, the optical device being mounted to the substrate.

6. The optical device package of claim 5 wherein the optical device is positioned between a distal end of the optical fiber and the optical semiconductor component.

7. The optical device package of claim 2 wherein the distal longitudinally extending notch and the proximal longitudinally extending notch are separated from each other by a lateral groove in the substrate, wherein the optical fiber is positioned within the distal longitudinally extending notch, wherein the substrate includes a recess in the upper surface, and wherein both the distal longitudinally extending notch and the proximal longitudinally extending notch are proximal to the recess in the upper surface of the substrate.

8. The optical device package of claim 2 wherein the substrate comprises a recess in the upper surface, the distal longitudinally extending notch being distal to the recess and the proximal longitudinally extending notch being proximal to the recess.

9. The optical device package of claim 8 wherein the at least one optical fiber comprises a proximal optical fiber positioned within the proximal longitudinally extending notch and a distal optical fiber is positioned within the distal longitudinally extending notch.

10. The optical device package of claim 9 wherein the proximal optical fiber has a proximal end which is flush with the proximal end of the substrate.

11. The optical device package of claim 10 wherein the distal optical fiber has a distal end which is flush with the distal end of the substrate.

12. The optical device package of claim 1 further comprising a ferrule having a bore through which the optical fiber is disposed, the ferrule being positioned between the frame and the substrate.

13. The optical device package of claim 1 further comprising a plurality of bonding pads disposed on the upper surface of the substrate.

14. The optical device package of claim 1 comprising a plurality of parallel spaced apart optical fibers disposed within corresponding parallel spaced apart longitudinally extending notches.

15. An optical device package comprising:

a) a substrate having an upper surface, a distal end, and a proximal end, and at least a first longitudinally extending notch having a proximal end caterminous with the proximal end of the substrate;

b) at least one longitudinally oriented optical fiber mounted to the substrate and having a proximal end spaced apart from, and distal to, the proximal end of the notch; and

c) a frame comprising a band-like member defining an opening, the frame circumscribing the opening and being mounted to the substrate, the opening exposing the upper surface of the substrate.

16. The optical device package of claim 15 wherein the frame has at least one recessed portion.

17. The optical device package of claim 16 further comprising a lid for enclosing the optical semiconductor component in an interior space, the lid being mounted to an upper surface of the frame.

18. The optical device package of claim 17 wherein the lid has a proximal end which is distal to the proximal end of the optical fiber.

19. The optical device package of claim 15 further comprising an optical semiconductor component mounted to the substrate.

20. The optical device package of claim 15 wherein the substrate comprises a second longitudinally extending notch co-linear with and distal to the first longitudinally extending notch, wherein the first and second longitudinally extending notches are separated by a groove extending laterally across the substrate, and wherein the proximal end of the optical fiber extends over the lateral groove.

21. The optical device package of claim 15 wherein the opening extends through the frame.

22. An optical device package comprising:

a) a substrate having an upper surface, a distal end, and a proximal end, and at least a first longitudinally extending notch having a proximal end coterminous with the proximal end of the substrate;

b) at least one longitudinally oriented optical fiber mounted to the substrate and having a proximal end spaced apart from, and distal to, the proximal end of the notch;

c) an optical semiconductor component mounted to the substrate; and

d) a lid for enclosing the optical semiconductor component in an interior space, the lid being mounted to the upper surface of the substrate.