Method of making a contact

• US 7,363,705 B2
• Filed: 01/03/2005
• Issued: 04/29/2008
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Zhang, Gang, Cohen, Adam L., Lockard, Michael S., Arat, Vacit, Kim, Kieun, Kruglick, Ezekiel J. J., Chen, Richard T., Kumar, Ananda H., Larsen, Willa M.
• Primary Examiner(s): Arbes; Carl J.
• Application Number:
  US11/028,962
• Publication Number:
  US 20060286829A1
• Time in Patent Office: 1,212 Days
• Field of Search: 298/40, 298/42, 298/74, 298/84, 174/261, 324/754, 324/761
• US Class Current: 29/842
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Claims

1. A method for creating a contact structure, comprising:

(a) forming compliant probe structure electrochemically, comprising;

(i) forming a first layer on substrate, comprising;

a. depositing a first material selected from a conductive structural material or a conductive sacrificial material;

b. depositing a second material selected from the conductive structural material or the conductive sacrificial material, wherein the second material is different from the first material, and

c. planarizing both the first and second materials;

(ii) forming and adhering each of one or more successive layers to the first layer and/or to a previously formed successive layer, comprising;

a. depositing a first material selected from a conductive structural material or a conductive sacrificial material;

b. depositing a second material selected from the conductive structural material or the conductive sacrificial material, wherein the second material is different from the first material, and

c. planarizing both the first and second materials; and

(b) forming a contact tip having a desired configuration on the compliant probe structure;

(c) after formation of a plurality of layers of the compliant probe structure, removing sacrificial material from a plurality of layers of the structural material.

2. The method of claim 1 wherein the contact tip has a shape wherein the shape is derived at least in part via etching of a patterned tip material.

3. The method of claim 1 wherein the contact tip has a shape wherein the shape is derived at least in part via isotropic etching of a tip material around etching shields.

4. The method of claim 1 wherein the contact tip comprises a different material than the compliant probe structure.

5. The method of claim 1 wherein the contact tip comprises the same material as the probe structure.

6. The method of claim 1 wherein the contact tip comprises a coating material.

7. The method of claim 1 wherein the contact tip comprises a coating material and the probe structure comprises a coating material.

8. The method of claim 7 wherein the coating material on the tip is different from the coating material on the probe structure.

9. The method of claim 7 wherein the coating material on the tip is the same as the coating material on the probe structure.