System and method for a three-axis MEMS accelerometer

• US 7,367,232 B2
• Filed: 01/24/2005
• Issued: 05/06/2008
• Est. Priority Date: 01/24/2004
• Status: Expired due to Fees

• Current Assignee: Nickolai Belov, Vladimir Vaganov
• Original Assignee: Nickolai Belov, Vladimir Vaganov
• Inventors: Belov, Nickolai, Vaganov, Vladimir
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US11/042,721
• Publication Number:
  US 20050160814A1
• Time in Patent Office: 1,198 Days
• Field of Search: 735/143.3
• US Class Current: 73/514.33
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape

Abstract

A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

Claims

1. A method of determining three components of an applied inertial force with respect to an orthogonal coordinate system, said method comprises the steps of:

providing a semiconductor sensor chip having side 1 and comprising a frame element, a proof mass element and an elastic element mechanically coupling the frame and proof mass element;

selectively positioning only three stress-sensitive IC components integrated into three local areas of the elastic element;

orienting the orthogonal coordinate system such that X and Y axes are located in the plane of side 1 and Z axis is perpendicular to side 1;

applying a known inertial force to the sensor chip along X, Y and Z axes;

determining the matrix of offsets and matrix of sensitivities of the stress-sensitive IC components to the orthogonal components of the known applied force;

determining three orthogonal components of the unknown applied inertial force by solving with digital processing a system of three equations containing the three orthogonal components of the unknown applied force, matrixes of offsets and sensitivities of the stress-sensitive IC components to orthogonal components of the known inertial force vector.

2. A three-axis accelerometer for determining components of an inertial force vector with respect to an orthogonal coordinate system, the accelerometer comprising:

a sensor die made of a semiconductor substrate comprising;

a frame element;

a proof mass element;

an elastic element mechanically coupling the frame and the proof mass, wherein the inertial force applied to proof mass induces stress in the elastic element;

more than three stress-sensitive IC components, which are used for creating more than one sets of three stress-sensitive IC components and integrated into local areas of the elastic element;

a digital signal processing circuit for processing of signals from stress-sensitive IC components;

whereby stress-sensitive IC components generate signals resulting from the stresses in the elastic element and at least one set of three stress-sensitive IC components is used for determining an unknown applied force vector components and the remaining sets of three stress-sensitive IC components are used for increasing the accuracy and reliability of the three-axis accelerometer.

3. A three-axis accelerometer of claim 2, whereby signals generated by stress-sensitive IC components from the applied force, are measured relative to a reference signal for increasing the ratios of the signals to offsets, reducing the temperature dependence of offsets and sensitivities and simplifying signal processing.

4. A three-axis accelerometer of claim 2, wherein the stress sensitive IC components are chosen from the group consisting of:

a piezoresistor, a p-n junction, a tunnel diode, a Schottky diode, a shear stress component, a piezoresistive Wheatstone bridge, a MOS transistor, a complementary pair of CMOS transistors, a bipolar transistor, a pair of p-n-p and n-p-n bipolar transistors, a bipolar transistor and at least one piezoresistor connected to transistor, a MOS transistor and at least one piezoresistor connected to transistor, a bipolar transistor circuit, and a CMOS transistor circuit.

5. A three-axis accelerometer of claim 2, further comprising at least one sensor component chosen from the group of sensors consisting of temperature sensor, magnetic sensor, pressure sensor, tactile sensor, acoustic sensor, chemical sensor, humidity sensor, radiation sensor, mass flow sensor, and optical sensor.

6. A three-axis accelerometer of claim 2, wherein the semiconductor substrate is comprised of monocrystalline material exhibiting dependence of mobility of electrons and holes on mechanical stress and chosen from the group consisting of silicon, germanium, silicon carbide, carbon, gallium arsenide, gallium nitride, and indium phosphide.

7. A three-axis accelerometer of claim 2, further comprising at least one electronic circuit providing one or more functions from a group of functions consisting of providing reference signals, signal amplification, multiplexing, signal filtering, analog-to-digital conversion, signal processing, voltage stabilization, current stabilization, memory for compensation coefficients, temperature compensation, digital interface, power management, transmitting and receiving radio-signals.

8. A three-axis accelerometer of claim 7 wherein at least one electronic circuit is located on the sensor die.

9. A three-axis accelerometer of claim 2, wherein the elastic element has at least one opening in its thickness dimension.

10. A three-axis accelerometer of claim 2, wherein the elastic element contains at least two stress concentrating elements having a shape selected from a group of shapes consisting of V-groove, trapezoidal groove, and a groove with the sidewalls forming an angle in the range of 90°

±

5°

with the surface of the elastic element.

11. A three-axis accelerometer of claim 2, where the elastic element in the sensor chip has the shape chosen from the group of shapes consisting of ring, perforated ring, n-sided faceted geometry, beams, tethers, springs and combinations of these shapes.

12. A method of determining three components of an unknown applied inertial force with respect to an orthogonal coordinate system and increasing accuracy of three-axis accelerometer, said method comprises the steps of:

providing a semiconductor sensor chip having side 1 and comprising a frame element, a proof mass element and an elastic element mechanically coupling the frame and proof mass element;

providing more than three stress-sensitive IC components each integrated into a local area of the elastic element;

orienting the orthogonal coordinate system such that two axes are located in the plane of side 1 and the third axis is perpendicular to side 1;

applying a known inertial force to the sensor chip along the orthogonal axes for calibration;

determining the matrix of offsets and matrix of sensitivities of all stress-sensitive IC components to the orthogonal components of the known applied force;

creating sets of independent systems of three equations based on a number of non-repeating combinations from the number of stress-sensitive IC components in threes;

each independent combination of three stress-sensitive IC components corresponds to each independent systems of three equations;

each independent system of three equations contains three unknown variables corresponding to orthogonal components of unknown applied force, (1×

3) matrix of offsets and (3×

3) matrix of sensitivities of the corresponding stress-sensitive IC components to orthogonal components of the known inertial force vector;

determining three orthogonal components of the unknown applied inertial force by solving at least one independent system of three equations;

increasing accuracy of determining three components of an applied inertial force by solving other independent systems of three equations and by averaging the results of independent solutions.

13. A method of claim 12, further comprising the step of:

creating sets of independent systems of three equations based on working stress-sensitive IC components, where the number of sets of independent systems is equal to a number of non-repeating combinations from the number of working stress-sensitive IC components in threes;

whereby increased reliability of three-axis accelerometer is provided by at least three working stress-sensitive IC components participating in the sets of independent systems of three equations while determining three components of an unknown applied inertial force.