Low cost electronic probe devices manufactured from conductive loaded resin-based materials

• US 7,372,422 B2
• Filed: 01/30/2006
• Issued: 05/13/2008
• Est. Priority Date: 02/15/2001
• Status: Expired due to Fees

• Current Assignee: Integral Technologies, Inc.
• Original Assignee: Integral Technologies, Inc.
• Inventors: Aisenbrey, Thomas
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US11/343,019
• Publication Number:
  US 20060119523A1
• Time in Patent Office: 834 Days
• Field of Search: 343/788, 343/872, 343/787
• US Class Current: 343/788
• CPC Class Codes: G01R 1/067 Measuring probes
• CPC Class Codes: G01R 1/06788 Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments end pieces terminating in a probe H01R11/18
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

Electronic probe devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Claims

1. An electronic probing device comprising:

a magnet;

a conductive coil surrounding said magnet wherein movement of said conductive coil with respect to said magnet generates current in said conductive coil; and

an enclosure containing said magnet and said conductive coil wherein said enclosure comprises a conductive loaded, resin-based material comprising conductive materials in a base resin host.

2. The device according to claim 1 wherein the ratio, by weight, of said conductive materials to said resin host is between about 0.20 and about 0.40.

3. The device according to claim 1 wherein said conductive materials comprise micron conductive powder.

4. The device according to claim 3 wherein said micron conductive powder is metal powder.

5. The device according to claim 3 wherein said micron conductive powder has a non-metal core with a metal layer plated thereon.

6. The device according to claim 3 wherein said micron conductive powder is a non-metal conductive powder.

7. The device according to claim 3 wherein said micron conductive powder is a combination of metal and non-metal powder.

8. The device according to claim 1 wherein said conductive materials comprise micron conductive fiber.

9. The device according to claim 8 wherein said micron conductive fiber is metal fiber.

10. The device according to claim 8 wherein said micron conductive fiber has a non-metal core with a metal layer plated thereon.

11. The device according to claim 8 wherein said micron conductive fiber pieces each have a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

12. The device according to claim 1 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.

13. The device according to claim 1 wherein said conductive coil comprises said conductive loaded, resin-based material.

14. An electronic probing device comprising:

a magnet;

a conductive coil surrounding said magnet wherein movement of said conductive coil with respect to said magnet generates current in said conductive coil; and

an enclosure containing said magnet and said conductive coil wherein said enclosure comprises a conductive loaded, resin-based material comprising micron conductive fiber in a base resin host.

15. The device according to claim 14 wherein said micron conductive fiber is metal fiber.

16. The device according to claim 14 wherein said micron conductive fiber has a non-metal core with a metal layer plated thereon.

17. The device according to claim 14 further comprising micron conductive powder.

18. The device according to claim 17 wherein said micron conductive powder is a metal powder.

19. The device according to claim 17 wherein said micron conductive powder has a non-metal core with a metal layer plated thereon.

20. The device according to claim 17 wherein said micron conductive powder is a non-metal conductive powder.