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Reduction of near field electro-magnetic scattering using high impedance metallization terminations

  • US 7,376,408 B2
  • Filed: 08/10/2004
  • Issued: 05/20/2008
  • Est. Priority Date: 08/10/2004
  • Status: Active Grant
First Claim
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1. A method of attenuating scattering electro-magnetic waves present on metallized areas within a mobile phone caused by components within the mobile phone, the method comprising placing discrete components near an edge of the metallized areas, the discrete components obstructing a current path of scattering electro-magnetic waves present on the metallized areas such that electric current due to the scattering electro-magnetic waves present on the metallized areas encounters higher impedances as the scattering electro-magnetic waves flow through the discrete components near the edge of the metallized areas, the higher impedances attenuating the scattering electro-magnetic waves emitted from the edge of the metallized areas.

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