Nitride semiconductor device comprising bonded substrate and fabrication method of the same

• US 7,378,334 B2
• Filed: 02/01/2006
• Issued: 05/27/2008
• Est. Priority Date: 07/08/2002
• Status: Expired due to Term

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Yamamoto, Masashi, Sakamoto, Keiji, Sano, Masahiko, Nagahama, Shinichi, Morita, Daisuke, Yanamoto, Tomoya
• Primary Examiner(s): Le; Thao X.
• Assistant Examiner(s): Ullah; Elias
• Application Number:
  US11/344,197
• Publication Number:
  US 20060128118A1
• Time in Patent Office: 846 Days
• Field of Search: 438/518, 257/E21.699
• US Class Current: 438/518
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01037 Rubidium [Rb]
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

Claims

1. A fabrication method of a nitride semiconductor devices, comprising:

forming an under layer comprising GaN on a first face of a substrate for growing nitride semiconductor, the substrate for growing nitride semiconductor having a second face that mutually opposes the first face;

forming a stack of nitride semiconductor by growing one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1), and one or more p-type nitride semiconductor layers on the under layer,

wherein the substrate for growing nitride semiconductor has a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers, and the active layer has a luminescence wavelength of 380 nm or shorter;

forming a first bonding layer including one or more metal layers on said p-type nitride semiconductor layers;

forming a second bonding layer including one or more metal layers on a first face of a supporting substrate having a second face that mutually opposes the first face and having a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers and equal to or smaller than that of said substrate for growing nitride semiconductor;

bonding the first bonding layer and the second bonding layer by setting said first bonding layer and said second bonding layer to face each other, pressing said stack of nitride semiconductor and said supporting substrate together, and applying heat; and

removing said substrate for growing nitride semiconductor from said stack of the nitride semiconductor.

2. The fabrication method of a nitride semiconductor device according to claim 1, wherein said supporting substrate is conductive.

3. The fabrication method of a nitride semiconductor device according to claim 1, wherein said substrate for growing nitride semiconductor is an insulating substrate.

4. The fabrication method of a nitride semiconductor device according to claim 1, wherein said supporting substrate is conductive and said substrate for growing nitride semiconductor is an insulating substrate.

5. The fabrication method according to claim 1, wherein said first bonding layer has an ohmic electrode layer formed adjacent to said p-type nitride semiconductor layers.

6. The fabrication method of a nitride semiconductor device according to claim 1, wherein said first bonding layer and said second bonding layer respectively have a first eutectic-forming layer and a second eutectic-forming layer, and form an eutectic by mutual diffusion of metals composing the first and the second eutectic-forming layers during the bonding of the first bonding layer and the second bonding layer.

7. The fabrication method according to claim 1, wherein an under layer including a buffer layer of Ga_eAl₁₋

eN, (0<

e≦

1) and a high-temperature-grown layer of either undoped GaN or GaN doped with an n-type impurity are formed directly on the first face of said substrate for growing nitride semiconductor.

8. The fabrication method according to claim 7, wherein said buffer layer and said high-temperature-grown layer are removed after said substrate for growing nitride semiconductor is removed.

9. The fabrication method according to claim 1, wherein said well layer and barrier layer are respectively Al_aIn_bGa₁₋

a−

bN, (0<

a≦

1, 0<

b≦

1, a+b<

1) and Al_cIn_dGa<sub>1−

c−

d</sub>N, (0<

c≦

1, 0<

d≦

1, c+d<

1), and said n-type nitride semiconductor layers comprise Al.

10. A fabrication method of a nitride semiconductor device, comprising:

forming a stack of nitride semiconductor by growing one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1), and one or more p-type nitride semiconductor layers on a first face of a substrate for growing nitride semiconductor that has a second face that mutually opposes the first face, the substrate for growing nitride semiconductor having a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers;

forming a first bonding layer including one or more metal layers on said p-type nitride semiconductor layers;

forming a second bonding layer including one or more metal layers on a first face of a supporting substrate having a second face that mutually opposes the first face and having a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers and equal to or smaller than that of said substrate for growing nitride semiconductor;

bonding the first bonding layer and the second bonding layer by setting said first bonding layer and said second bonding layer to face each other, pressing said stack of nitride semiconductor and said supporting substrate together, and applying heat; and

removing said substrate for growing nitride semiconductor from said stack of the nitride semiconductor,

wherein said substrate for growing nitride semiconductor is removed by radiating an electromagnetic wave to the entire second face of said substrate for growing nitride semiconductor.

11. A fabrication method of a nitride semiconductor device, comprising:

forming a stack of nitride semiconductor by growing one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1), and one or more p-type nitride semiconductor layers on a first face of a substrate for growing nitride semiconductor that has a second face that mutually opposes the first face, the substrate for growing nitride semiconductor having a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers;

forming a first bonding layer including one or more metal layers on said p-type nitride semiconductor layers;

forming a second bonding layer including one or more metal layers on a first face of a supporting substrate having a second face that mutually opposes the first face and having a thermal expansion coefficient higher than those of said n-type and p-type nitride semiconductor layers and equal to or smaller than that of said substrate for growing nitride semiconductor;

bonding the first bonding layer and the second bonding layer by setting said first bonding layer and said second bonding layer to face each other, pressing said stack of nitride semiconductor and said supporting substrate together, and applying heat; and

removing said substrate for growing nitride semiconductor from said stack of the nitride semiconductor,

wherein a coating layer containing a phosphor substance is formed at least in a portion of a surface of said nitride semiconductor device.

12. A fabrication method of a nitride semiconductor device, comprising:

growing an under layer including a nitride semiconductor comprising GaN and having a characteristic to absorb the light emitted by said device on a first face of a substrate for growing, the substrate for growing having a second face that mutually opposes the first face;

forming one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1),and one or more p-type nitride semiconductor layers on said under layer, said active layer having a luminescence wavelength of 380 nm or shorter;

bonding a supporting substrate to the surface of said p-type nitride semiconductor layers; and

removing said substrate for growing and said under layer.

13. The fabrication method according to claim 12, wherein said well layer and barrier layer are respectively Al_aIn_bGa₁₋

a−

bN, (0<

a≦

1, 0<

b≦

1, a+b<

1) and Al_cIn_dGa<sub>1−

c−

d</sub>N, (0<

c≦

1, 0<

d≦

1, c+d<

1), and said n-type nitride semiconductor layers comprise Al.

14. A fabrication method of a nitride semiconductor device, comprising:

growing an under layer comprising a nitride semiconductor having a characteristic to absorb the light emitted by said device on a first face of a substrate for growing, the substrate for growing having a second face that mutually opposes the first face;

forming one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1), and one or more p-type nitride semiconductor layers on said under layer;

bonding a supporting substrate to the surface of said p-type nitride semiconductor layers; and

removing said substrate for growing and said under layer,

wherein said substrate for growing is removed by radiating an electromagnetic wave to the entire second face of said substrate for growing.

15. A fabrication method of a nitride semiconductor device, comprising:

growing an under layer comprising a nitride semiconductor having a characteristic to absorb the light emitted by said device on a first face of a substrate for growing, the substrate for growing having a second face that mutually opposes the first face;

forming one or more n-type nitride semiconductor layers, an active layer having a quantum well structure comprising a well layer of Al_aIn_bGa<sub>1−

a−

b</sub>N, (0≦

a≦

1, 0≦

b≦

1, a+b≦

1) and a barrier layer of Al_cIn_dGa<sub>1−

c−

d</sub>N, (0≦

c≦

1, 0≦

d≦

1, c+d≦

1), and one or more p-type nitride semiconductor layers on said under layer;

bonding a supporting substrate to the surface of said p-type nitride semiconductor layers; and

removing said substrate for growing and said under layer,

wherein a coating layer containing a phosphor substance is formed at least in a portion of a surface of said nitride semiconductor device.