Dual wafer pressure sensor
First Claim
1. A pressure sensor for sensing a fluid pressure, the pressure sensor comprising:
- a first wafer substrate with a front side and an opposing back side, a cavity extending from the front side to the back side and a flexible membrane formed on the front side to seal the cavity; and
,a second wafer at the back side of the first wafer to seal the cavity and define a chamber;
the second wafer joined to the first wafer by direct wafer bonding whereby the contacting surfaces of the first and second wafers are ultra clean, and activated by making them hydrophilic or hydrophobic prior to bonding, and then brought into contact at high temperature;
wherein,the chamber contains a fluid at a reference pressure, such that the flexible membrane deflects due to pressure differentials between the reference pressure and the fluid pressure; and
,associated circuitry for converting the deflection of the flexible membrane into an output signal indicative of the fluid pressure.
2 Assignments
0 Petitions
Accused Products
Abstract
A pressure sensor (30) for sensing a fluid pressure in harsh environments such as the air pressure in a tire. The sensor has a dual wafer construction with a first wafer substrate (32) that has a cavity extending from its front side to the opposing back side. A flexible membrane (50) seals the cavity at the front side and a second wafer (31) seals the cavity at the back side of the first wafer (32) to form a chamber (58) containing a fluid at a reference pressure. The flexible membrane (50) deflects due to pressure differentials between the reference pressure and the fluid pressure and associated circuitry (34) for converts the deflection of the flexible membrane (50) into an output signal indicative of the fluid pressure. The second wafer (31) is wafer bonded to the first wafer substrate (32) as wafer bonding offers an effective non-adhesive solution. It provides a hermetic seal with only minor changes to the fabrication procedure. Skilled workers in this field will readily understand that the most prevalent forms of wafer bonding are:
direct wafer, or silicon fusion, bonding;
anodic, or electrostatic Mallory process bonding; and,
intermediate layer bonding.
18 Citations
16 Claims
-
1. A pressure sensor for sensing a fluid pressure, the pressure sensor comprising:
-
a first wafer substrate with a front side and an opposing back side, a cavity extending from the front side to the back side and a flexible membrane formed on the front side to seal the cavity; and
,a second wafer at the back side of the first wafer to seal the cavity and define a chamber;
the second wafer joined to the first wafer by direct wafer bonding whereby the contacting surfaces of the first and second wafers are ultra clean, and activated by making them hydrophilic or hydrophobic prior to bonding, and then brought into contact at high temperature;
wherein,the chamber contains a fluid at a reference pressure, such that the flexible membrane deflects due to pressure differentials between the reference pressure and the fluid pressure; and
,associated circuitry for converting the deflection of the flexible membrane into an output signal indicative of the fluid pressure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
Specification