Methods and systems for thermal-based laser processing a multi-material device
First Claim
1. A method for thermal-based laser processing a multi-material device including a substrate and a microstructure, the method comprising:
- generating two or more laser pulses having at least one predetermined characteristic based on a differential thermal property of materials of the device; and
irradiating the microstructure with the two or more laser pulses wherein a first pulse increases a difference in temperature between the substrate and the microstructure and wherein a second pulse further increases the difference in temperature between the substrate and the microstructure to process the multi-material device without damaging the substrate;
wherein the pulses are spaced such that the temperature of the substrate decays rapidly and stabilizes during a time between irradiation of the microstructure with a pair of pulses of said two or more laser pulses, and wherein the two or more pulses irradiate the microstructure during relative motion between the microstructure and a laser beam path associated with the pulses.
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Abstract
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
203 Citations
20 Claims
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1. A method for thermal-based laser processing a multi-material device including a substrate and a microstructure, the method comprising:
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generating two or more laser pulses having at least one predetermined characteristic based on a differential thermal property of materials of the device; and irradiating the microstructure with the two or more laser pulses wherein a first pulse increases a difference in temperature between the substrate and the microstructure and wherein a second pulse further increases the difference in temperature between the substrate and the microstructure to process the multi-material device without damaging the substrate; wherein the pulses are spaced such that the temperature of the substrate decays rapidly and stabilizes during a time between irradiation of the microstructure with a pair of pulses of said two or more laser pulses, and wherein the two or more pulses irradiate the microstructure during relative motion between the microstructure and a laser beam path associated with the pulses. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for thermal-based laser processing a multi-material device including a substrate and a microstructure, the system comprising:
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means for generating two or more laser pulses having at least one predetermined characteristic based on a differential thermal property of materials of the device; and means for irradiating the microstructure with the two or more laser pulses wherein a first pulse increases a difference in temperature between the substrate and the microstructure and wherein a second pulse further increases the difference in temperature between the substrate and the microstructure to process the multi-material device without damaging the substrate; wherein the temperature of the substrate decays rapidly and stabilizes during the time between irradiation of the microstructure with a pair of pulses of said two or more laser pulses, and wherein the two or more pulses irradiate the microstructure during relative motion between the microstructure and a laser beam path associated with the pulses. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification