Method for low temperature bonding and bonded structure

  • US 7,387,944 B2
  • Filed: 08/09/2004
  • Issued: 06/17/2008
  • Est. Priority Date: 02/16/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A bonding method, comprising:

  • forming first and second insulating layers on first and second materials, respectively;

    etching surfaces of one of said first and second layers;

    bringing together at room temperature said surfaces of said first and second layers after said etching step; and

    forming a chemical bond between said first and second layers at room temperature.

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