Flip chip bonding tool tip

  • US 7,389,905 B2
  • Filed: 09/15/2004
  • Issued: 06/24/2008
  • Est. Priority Date: 02/25/1999
  • Status: Expired due to Fees
First Claim
Patent Images

1. A flip chip bonding tool tip for use in flip chip bonding machines for connecting leads on integrated circuit banding pads, the flip chip bonding tool tip comprising a dissipative material, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded, wherein the dissipative material comprises a doped semi-conductor formed in a conducting core and the conducting core comprises a cobalt-bonded tungsten carbide coated with titanium nitride carbide.

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