Active primary-sided circuit arrangement for a switch-mode power supply

• US 7,403,399 B2
• Filed: 03/30/2006
• Issued: 07/22/2008
• Est. Priority Date: 03/31/2005
• Status: Active Grant

• Current Assignee: MyPAQ Holdings Ltd. (Transpacific IP Group Limited)
• Original Assignee: Friwo Mobile Power GmbH
• Inventors: Bothe, Michael, Morbe, Stefan
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US11/394,734
• Publication Number:
  US 20060238927A1
• Time in Patent Office: 845 Days
• Field of Search: 361/820, 362/37, 362/97, 323/351
• US Class Current: 361/820
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H02M 3/28 using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac

Abstract

The invention under consideration refers to a circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer, and wherein the circuit arrangement comprises a primary-sided switch, a control circuit for controlling the primary-sided switch and additional active primary-sided components. Furthermore, the invention under consideration also refers to a switch-mode power supply with an active primary-sided circuit arrangement of that type. In order to specify an improved circuit arrangement that overcomes the disadvantages of the known solutions and that makes it possible to assemble a switch-mode power supply in miniaturised form in a manner that is particularly simple and economical while still complying with applicable safety standards, the control circuit is formed by a first integrated semiconductor chip and the primary-sided switch and the additional components are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and being arranged on a single circuit carrier shared with the control circuit.

Claims

1. Circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer,

wherein the circuit arrangement (100) comprises a primary-sided switch (102), a control circuit (104) for controlling the primary-sided switch (102) and additional active, primary-sided components (106, 108, 110),

wherein said control circuit (104) is formed by a first integrated semiconductor chip and the primary-sided switch (102) and the additional components (106, 108, 110), are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and arranged on a circuit carrier (112) shared with the control circuit.

2. Circuit arrangement according to claim 1, wherein the control circuit (104), the primary-sided switch (102) and the additional primary-sided components (106, 108, 110) are accommodated in a shared housing (118).

3. Circuit arrangement according to claim 2, wherein the housing (118) is executed as a wired housing.

4. Circuit arrangement according to claim 2, wherein the housing (118) is executed as a housing that can be surface-mounted for surface-mount technologies.

5. Circuit arrangement according to claim 1, wherein the circuit carrier is executed as a leadframe (112).

6. Circuit arrangement according to claim 1, wherein a metallization of the circuit carrier (112) has cooling areas that are formed for removing heat.

7. Circuit arrangement according to claim 1, wherein the additional active components comprise four rectifier diodes (106).

8. Circuit arrangement according to claim 1, wherein the additional active components comprise a diode (108) for the auxiliary power supply.

9. Circuit arrangement according to claim 1, wherein the additional active components comprise a snubber diode (110).

10. Circuit arrangement according to claim 1, wherein the additional active components (106, 108, 110) are at least partially combined into a single semiconductor chip and are monolithically integrated.

11. Circuit arrangement according to claim 1, wherein at least those additional components (106, 108, 110) that are under high voltages are executed in a silicon-on-insulator technology and the control circuit (104) is formed as a silicon semiconductor circuit.

12. Circuit arrangement according to claim 1, wherein the circuit carrier has a ceramic substrate comprising multiple layers.

13. Switch-mode power supply having a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer,

said switch-mode power supply comprising a circuit arrangement which comprises a primary-sided switch, a control circuit for controlling the primary-sided switch and additional active, primary-sided components,

wherein said control circuit is formed by a first integrated semiconductor chip and the primary-sided switch and the additional components, are integrated in at least one additional semiconductor chip, said semiconductor chip being separate from the control circuit and arranged on a circuit carrier shared with the control circuit.