Synthetic resin card and method of producing the same

• US 7,404,998 B2
• Filed: 06/23/2004
• Issued: 07/29/2008
• Est. Priority Date: 06/24/2003
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Matsumura, Shinichi, Ohta, Eiji, Sudo, Miki
• Primary Examiner(s): Chen; Vivian
• Application Number:
  US10/560,445
• Publication Number:
  US 20060141227A1
• Time in Patent Office: 1,497 Days
• Field of Search: None
• US Class Current: 428/212
• CPC Class Codes: B32B 2250/05 5 or more layers
• CPC Class Codes: B32B 2250/244 All polymers belonging to those covered by group B32B27/36
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2270/00 Resin or rubber layer containing a blend of at least two different polymers
• CPC Class Codes: B32B 2307/518 bi-axially
• CPC Class Codes: B32B 2307/746 Slipping, anti-blocking, low friction
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 27/365 comprising polycarbonates
• CPC Class Codes: B42D 25/00 Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof printing processes to produce identification or security features B41M3/14
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/24959 of adhesive layers
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31797 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31935 : Ester, halide or nitrile of addition polymer
• CPC Class Codes: Y10T 428/31938 : Polymer of monoethylenically unsaturated hydrocarbon

Abstract

A synthetic resin card in which card warpage can be reduced and a method for producing the same are provided. By setting the difference Δ in the angle of orientation between outer layers symmetrically laminated on a card core section, it is possible to reduce imbalance of stress resulting from the difference in the shrinkage factor between the outer layers, and card warpage can be suppressed. Furthermore, by setting the thickness of the outer layers at 25 μm to 125 μm, rising of the surface of the synthetic resin card can be reduced. By reducing the card warpage and the rising of the surface of the synthetic resin card, it is possible to improve moving characteristics when the synthetic resin card is allowed to move in a device.

Claims

1. A synthetic resin card comprising:

a substantially planar core section; and

a first outer layer and a second outer layer laminated on front and back surfaces of the core section, respectively,

wherein,

the first outer layer and the second outer layer have molecular orientations,

the first outer layer and the second outer layer are adhered directly to the front and back surfaces of the core section by means of a thermal pressing and are symmetrically bonded to the core section, and

the difference Δ

in the angle of orientation between the molecular orientations of the first and second outer layers is 20°

or less causing the synthetic resin card warpage to be 1.5 mm or less, and at least one of the first and second outer layers is provided with a recording layer.

2. The synthetic resin card according to claim 1,

wherein,

the thicknesses of the first and second outer layers are symmetrical with respect to the core section.

3. The synthetic resin card according to claim 1,

wherein,

the first and second outer layers each have a thickness of 25 to 125 μ

m.

4. The synthetic resin card according to claim 1,

wherein,

the first and second outer layers are each formed of a biaxially oriented film.

5. The synthetic resin card according to claim 4,

wherein,

the biaxially oriented film comprises an oriented PET material.

6. The synthetic resin card according to claim 1,

wherein,

the core section comprises a first core layer and a second core layer between which is sandwiched an electric module.

7. The synthetic resin card according to claim 6,

wherein,

the first and second outer layers comprise films selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polyphenylene sulfide (PPS), polystyrene, polyamides, polyvinyl chloride (PVC) and polyvinylidene chloride.

8. The synthetic resin card according to claim 1,

wherein,

the recording layer is composed of a reversible thermosensitive material.

9. The synthetic resin card according to claim 1,

wherein,

the core section is composed of a copolymer of terephthalic acid, cyclohexanedimethanol, and ethylene glycol, and polycarbonate, the compounding ratio of the copolymer being 70% or less.

10. The synthetic resin card according to claim 1,

wherein,

the core section and the first and second outer layers are each composed of a halogen-free material.

11. The synthetic resin card of claim 1,

wherein,

the core section is made of a material selected from the group consisting of a copolymer of terephthalic acid, cyclohexanedimethanol, and ethylene glycol;

and a mixture of a polycarbonate resin and a copolymerized polyester resin prepared by replacing 10% to 70% of an ethylene glycol component with cyclohexanedimethanol in polyethylene terephthalate.

12. A method for producing a synthetic resin card comprising the steps of:

laminating a first outer layer with a first molecular orientation and a second outer layer with a second molecular orientation on front and back surfaces of a substantially planar core section, respectively, by means of thermal pressing process so that said front and second outer layers are directly adhered to said planar core section, and

forming at least one recording layer on at least one of the first outer layer and the second outer layer,

wherein,

the first and second outer layers are selected so that the difference Δ

in the angle of orientation between the molecular orientations of the first and second outer layers is 20°

or less so that the synthetic resin card warpage is 1.5 mm or less; and

the first and second outer layers are laminated so that the thicknesses of the first and second outer layers are symmetrical with respect to the core section.

13. The method according to claim 12,

wherein,

the first and second outer layers are each biaxially oriented films.

14. The method according to claim 13,

wherein,

the first and second outer layers are comprising of a material selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polyphenylene sulfide (PPS), polystyrene, polyamides, polyvinyl chloride (PVC) and polyvinylidene chloride.

15. The method of claim 12,

wherein,

the core section is made of a material selected from the group consisting of a copolymer of terephthalic acid, cyclohexanedimethanol, and ethylene glycol;

and a mixture of a polycarbonate resin and a copolymerized polyester resin prepared by replacing 10% to 70% of an ethylene glycol component with cyclohexanedimethanol in polyethylene terephthalate.