System and method for direct-bonding of substrates

• US 7,417,307 B2
• Filed: 07/29/2005
• Issued: 08/26/2008
• Est. Priority Date: 07/29/2005
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Piehl, Arthur, Chen, Chien-Hua, Haluzak, Charles C, Shih, Jennifer
• Primary Examiner(s): Wilczewski; M.
• Assistant Examiner(s): Chhaya; Swapneel
• Application Number:
  US11/192,377
• Publication Number:
  US 20070026559A1
• Time in Patent Office: 1,124 Days
• Field of Search: 257/682, 257/777, 257/85, 257/621, 257/774, 257/704, 438/109
• US Class Current: 257/682
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00285 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B

Abstract

A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.

Claims

1. A MEMS package, comprising:

a support base;

a MEMS cap forming a cavity with the support base, the cavity containing a plurality of MEMS actuators disposed on the support base therein;

an ambient port formed through the MEMS cap; and

a lid arrangement bonded to the MEMS cap, to hermetically close the ambient port;

a recess formed in the lid, the recess being configured to be in fluid communication with the ambient port; and

a contaminant absorbing material disposed in the recess.

2. A MEMS package as set forth in claim 1, wherein the ambient port is formed to open into the cavity at a location which is adjacent to and offset with respect to a location wherein the plurality of MEMS actuators are disposed.

3. A MEMS package as set forth in claim 1, further comprising a quantity of anti-stiction material disposed in the recess and enclosed therein by the lid.

4. A MEMS package as set forth in claim 1, further comprising an atmosphere enclosed in the cavity, the atmosphere having a content and pressure determined immediately prior closure of the ambient port by the lid.

5. A MEMS package set forth in claim 1, wherein the MEMS actuators include pixel plates forming a digital light display.

6. A MEMS package set forth in claim 1, wherein the contaminant absorbing material is a getter or a desiccant.

7. A MEMS package set forth in claim 1, wherein the contaminant absorbing material includes silicon dioxide.

8. A MEMS package, comprising:

a support base;

a MEMS cap means for forming a cavity with the support base which encloses a plurality of MEMS actuators disposed on the support base therein,

ambient port means formed in the MEMS cap for providing fluid communication with the cavity;

a lid arrangement bonded to the MEMS cap; and

means for protecting the plurality of MEMS actuators from contaminants trapped in the cavity;

wherein the protecting means comprises an absorbent material receiving means formed in the lid arrangement for receiving a contaminant absorbing material therein, the absorbent material receiving means being positioned to allow fluid communication between the contaminant absorbing material and the plurality of MEMS actuators through the ambient port.

9. The MEMS package as set forth in claim 8, wherein the contaminant absorbing material comprises a getter or a desiccant.

10. The MEMS package as set forth in claim 8, wherein the contaminant absorbing material comprises silicon dioxide.

11. The MEMS package as set forth in claim 8, wherein the protective means comprises a quantity of anti-stiction material which is introduced into the cavity through the ambient port.