Liquid cooling system including hot-swappable components

• US 7,420,804 B2
• Filed: 06/30/2004
• Issued: 09/02/2008
• Est. Priority Date: 06/30/2004
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Gonzales, Christopher A., Leija, Javier, Lucero, Christopher D.
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): WRIGHT, INGRID D
• Application Number:
  US10/881,884
• Publication Number:
  US 20060002080A1
• Time in Patent Office: 1,525 Days
• Field of Search: 361/687, 361/699, 165/80.4
• US Class Current: 361/679.48
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating. Other embodiments are described and claimed.

Claims

1. An apparatus comprising:

a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source attached to a first substrate;

a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate;

a leak-free connector attached to the first substrate and having a main inlet coupled to the outlet of the cold plate, a main outlet coupled to the inlet of the heat exchanger, and a pump interface including an inlet and an outlet; and

a hot-swappable pump module assembled on a second substrate and removably coupled to the pump interface, the hot-swappable pump module including a reservoir having an inlet and an outlet and at least one pump coupled to the reservoir.

2. The apparatus of claim 1 wherein the pump interface is a first pump interface, and wherein the leak-free connector further includes a second pump interface including an inlet and an outlet.

3. The apparatus of claim 2 wherein the hot-swappable pump module is a first hot-swappable pump module, and further comprising a second hot-swappable pump module connected to the second pump interface.

4. The apparatus of claim 2 wherein the leak-free connector is self-balancing.

5. The apparatus of claim 1 wherein the inlet and the outlet of the pump interface include quick connect/disconnect fittings thereon.

6. The apparatus of claim 1 wherein the leak-free connector further includes an electrical connector.

7. The apparatus of claim 6 wherein the hot-swappable pump module further includes an electrical connector that can couple to the electrical connector of the leak-free connector.

8. The apparatus of claim 1 wherein the hot-swappable pump module comprises:

a first pump whose inlet is connected to the outlet of the pump interface and whose outlet is connected the inlet of the reservoir; and

a second pump whose inlet is connected to the outlet of the reservoir and whose outlet is connected to the inlet of the pump interface.

9. The apparatus of claim 8 wherein the reservoir includes a fluid level sensor.

10. The apparatus of claim 9 wherein the hot-swappable pump module includes a logic circuit coupled to the fluid level sensor and to a visual indicator of the fluid level.

11. An apparatus comprising:

a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source;

a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate;

a leak-free connector having a main inlet, a main outlet, and a pump interface including an inlet and an outlet, wherein the main inlet is coupled to the outlet of the cold plate, the main outlet is coupled to the inlet of the heat exchanger; and

a hot-swappable pump module coupled to the pump interface, the hot-swappable pump module including a reservoir and at least one pump coupled to the reservoir.

12. The apparatus of claim 11 wherein the pump interface is a first pump interface, and wherein the leak-free connector further includes a second pump interface including an inlet and an outlet.

13. The apparatus of claim 12 wherein the hot-swappable pump module is a first hot-swappable pump module, and further comprising a second hot-swappable pump module connected to the second pump interface.

14. The apparatus of claim 13 wherein the leak-free connector is self-balancing.

15. The apparatus of claim 11 wherein the inlet and the outlet of the pump interface include quick connect/disconnect fittings thereon.

16. The apparatus of claim 11 wherein the leak-free connector includes an electrical connector coupled to a power source.

17. The apparatus of claim 16 wherein the hot-swappable pump module includes an electrical connector that can couple to the electrical connector of the leak-free connector.

18. The apparatus of claim 11 wherein the reservoir has an inlet and an outlet and the hot-swappable pump module includes:

a first pump whose inlet is connected to the outlet of the pump interface and whose outlet is connected the inlet of the reservoir; and

a second pump whose inlet is connected to the outlet of the reservoir and whose outlet is connected to the inlet of the pump interface.

19. The apparatus of claim 18 wherein the reservoir includes a fluid level sensor.

20. The apparatus of claim 19 wherein the hot-swappable pump module includes a logic circuit coupled to the fluid level sensor and to a visual indicator of the fluid level.

21. A system comprising:

a computer blade having thereon a processor and a synchronous dynamic random access memory (SDRAM);

a cold plate having an inlet and an outlet, the cold plate being attached to the processor;

a heat exchanger having an inlet and an outlet, wherein the heat exchanger is mounted to the blade and the outlet of the heat exchanger is coupled to the inlet of the cold plate; and

a hot-swappable pump module coupled to the cold plate and to the heat exchanger and assembled on a mezzanine card, the hot-swappable pump module including a reservoir having an inlet and an outlet and at least one pump coupled to the reservoir.

22. The system of claim 21, further comprising a leak-free connector attached to the blade, the leak-free connector having a main inlet, a main outlet, and a pump interface including an inlet and an outlet, wherein the main inlet is coupled to the fluid outlet of the cold plate, the main outlet is coupled to the inlet of the heat exchanger, and the hot-swappable pump module is coupled to the pump interface.

23. The system of claim 22 wherein the inlet and the outlet of the pump interface include quick connect/disconnect fittings thereon.

24. The system of claim 21 wherein the hot-swappable pump module comprises:

a first pump whose inlet is connected to the outlet of the pump interface and whose outlet is connected the inlet of the reservoir; and

a second pump whose inlet is connected to the outlet of the reservoir and whose outlet is connected to the inlet of the pump interface.

25. The system of claim 24 wherein the reservoir includes a fluid level sensor.

26. The system of claim 25 wherein the mezzanine card includes a logic circuit coupled to the fluid level sensor and to a visual indicator of the fluid level.

27. A process comprising:

cooling a heat source using a closed-loop cooling system comprising;

a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, and the heat source being attached to a first substrate,

a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate,

a leak-free connector attached to the first substrate and having a main inlet coupled to the outlet of the cold plate, a main outlet coupled to the inlet of the heat exchanger, and a pump interface including an inlet and an outlet, and

a hot-swappable pump module assembled on a second substrate and removably coupled to the pump interface, the hot-swappable pump module including a reservoir having an inlet and an outlet and at least one pump coupled to the reservoir; and

removing or installing the hot-swappable pump module while the cooling system is operating.

28. The process of claim 27 wherein the inlet and the outlet of the pump interface include quick connect/disconnect fittings thereon.

29. The process of claim 28 wherein the hot-swappable pump module comprises:

a first pump whose inlet is connected to the outlet of the pump interface and whose outlet is connected the inlet of the reservoir; and

a second pump whose inlet is connected to the outlet of the reservoir and whose outlet is connected to the inlet of the pump interface.