Capacitive pressure sensor with reference chamber

• US 7,430,919 B2
• Filed: 06/17/2007
• Issued: 10/07/2008
• Est. Priority Date: 10/18/2004
• Status: Expired due to Fees

• Current Assignee: Precision Mechatronics Pty Ltd
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, Mallinson, Samuel George
• Primary Examiner(s): Allen, Andre J.
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US11/764,227
• Publication Number:
  US 20070234814A1
• Time in Patent Office: 478 Days
• Field of Search: 73700-756, 3612831-2834
• US Class Current: 73/774
• CPC Class Codes: B60C 23/0408 transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver

Abstract

A capacitive pressure sensor includes a substrate assembly having a conductive layer. A conductive membrane is mounted to the substrate assembly so that a sealed reference chamber is defined by the conductive membrane and the substrate assembly. A cap is arranged on the substrate assembly and defines one or more apertures so that an antechamber is defined between the cap and the conductive membrane. Differential pressure between the reference chamber and antechamber can cause deflection of the conductive membrane which, in turn, varies the capacitance between the conductive membrane and the conductive layer.

Claims

1. A capacitive pressure sensor comprising:

a substrate assembly having a conductive layer;

a conductive membrane mounted to the substrate assembly so that a sealed reference chamber is defined by the conductive membrane and the substrate assembly; and

a cap arranged on the substrate assembly so as to cover, and be spaced from, the conductive membrane, the cap having one or more apertures such that differential pressure between the reference chamber and the space between the conductive membrane and cap can cause deflection of the conductive membrane which, in turn, varies the capacitance between the conductive membrane and the conductive layer.

2. A pressure sensor as claimed in claim 1, wherein the substrate assembly includes a silicon substrate, a CMOS layer deposited on the substrate, the conductive layer deposited on the CMOS layer and a passivation layer deposited on the conductive layer.

3. A pressure sensor as claimed in claim 1, wherein the substrate assembly defines a plurality of channels terminating in closed ends and forming part of the sealed reference chamber.

4. A pressure sensor as claimed in claim 3, wherein the substrate assembly comprises a silicon substrate defining through-channels and a termination layer mounted to the silicon substrate to terminate the channels in closed ends.

5. A capacitive pressure sensor comprising:

a substrate assembly having a conductive layer;

a conductive membrane mounted to the substrate assembly so that a sealed reference chamber is defined by the conductive membrane and the substrate assembly;

a cap arranged on the substrate assembly so as to cover, and be spaced from, the conductive membrane, the cap having one or more apertures such that differential pressure between the reference chamber and the space between the conductive membrane and cap can cause deflection of the conductive membrane which, in turn, varies the capacitance between the conductive membrane and the conductive layer; and

a cover configured to be engaged with the cap.

6. A pressure sensor as claimed in claim 5, wherein the cover defines a vent.

7. A pressure sensor as claimed in claim 6, wherein the cap defines a circular wall to which a circular internal wall of the cover can be snugly fitted.