Display device and method of fabricating the same

• US 7,446,843 B2
• Filed: 07/12/2007
• Issued: 11/04/2008
• Est. Priority Date: 03/10/1995
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakajima, Setsuo, Arai, Yasuyuki, Takemura, Yasuhiko, Yamazaki, Shunpei
• Primary Examiner(s): Dudek; James A
• Application Number:
  US11/776,683
• Publication Number:
  US 20070259585A1
• Time in Patent Office: 481 Days
• Field of Search: 349/190, 349/151, 349/187
• US Class Current: 349/151
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.

Claims

1. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming an orientation film over the electrode;

providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;

removing said second substrate holding said driver circuit over the first substrate to maintain said driver circuit over the first substrate;

forming a sealing material over the first substrate;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and counter substrates.

2. The method according to claim 1 wherein said display device is a passive type display device.

3. The method according to claim 1 wherein said display device is an active matrix display device.

5. The method according to claim 1 wherein the first substrate is a flexible substrate.

10. The method according to claim 1 wherein the driver circuit comprises thin film transistors.

4. A method of manufacturing an active matrix display device comprising:

forming an electrode over a first substrate;

forming an orientation film over the electrode;

providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;

removing said second substrate holding said driver circuit over the first substrate to maintain said driver circuit over the first substrate;

forming a sealing material over the first substrate;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and counter substrates.

6. The method according to claim 4 wherein the first substrate is a flexible substrate.

11. The method according to claim 4 wherein the driver circuit comprises thin film transistors.

7. A method of manufacturing a display device comprising:

forming a color filter over a first substrate;

forming a planarization film over the color filter;

forming an electrode over the planarization film;

forming an orientation film over the electrode;

providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;

removing said second substrate holding said driver circuit over the first substrate to maintain said driver circuit over the first substrate;

forming a sealing material over the first substrate wherein the driver circuit is located in a region surrounded by the sealing material;

dripping a liquid crystal material onto the orientation film;

bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and

cutting the bonded first and counter substrates,

wherein the driver circuit is located between the first and counter substrates.

8. The method according to claim 7 wherein said display device is a passive type display device.

9. The method according to claim 7 wherein said display device is an active matrix display device.

12. The method according to claim 7 wherein the driver circuit comprises thin film transistors.