Methods for producing MEMS with protective coatings using multi-component sacrificial layers

• US 7,450,295 B2
• Filed: 03/02/2006
• Issued: 11/11/2008
• Est. Priority Date: 03/02/2006
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Kogut, Lior, Tung, Ming-Hau
• Primary Examiner(s): Choi; William C
• Application Number:
  US11/367,098
• Publication Number:
  US 20070206267A1
• Time in Patent Office: 985 Days
• Field of Search: 359/247, 359/290, 438/52, 438/53
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81C 1/00801 Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer B81C1/00595, B81C1/00468 take precedence
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 2201/017 Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
• CPC Class Codes: B81C 2201/112 Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
• CPC Class Codes: B81C 2201/115 Roughening a surface
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31935 Ester, halide or nitrile of addition polymer

Abstract

Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

Claims

1. A method of manufacturing a microelectromechanical device, the method comprising:

forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and

selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material.

2. The method of claim 1, wherein the sacrificial material is selectively removed by etching, the protective material being substantially more resistant to the etching than the sacrificial material.

3. The method of claim 1, wherein forming the composite layer comprises separately depositing the sacrificial material and the protective material.

4. The method of claim 1, wherein forming the composite layer comprises depositing the protective material and the sacrificial material by chemical vapor deposition (CVD).

5. The method of claim 1, wherein forming the composite layer comprises depositing the sacrificial material and the protective material by sputtering each material from a separate target.

6. The method of claim 1, wherein the protective coating electrically insulates one or more surfaces of the microelectromechanical device.

7. The method of claim 1, wherein the protective coating thermally insulates one or more surfaces of the microelectromechanical device.

8. The method of claim 1, wherein the protective coating electrically and thermally insulates one or more surfaces of the microelectromechanical device.

9. The method of claim 1, wherein the protective coating is configured to reduce stiction between two or more components of the microelectromechanical device.

10. The method of claim 9, wherein a surface energy of the protective coating is lower than a surface energy of one or more of the surfaces of the microelectromechanical device.

11. The method of claim 9, wherein the one or more surfaces of the microelectromechanical device comprises a surface of a deformable layer, and the protective coating increases the restoring force of the deformable layer.

12. The method of claim 9, wherein the protective coating is substantially hydrophobic.

13. The method of claim 9, wherein the protective material is selected from diamond-like carbon, silicon-based particles, polystyrene, and PMMA.

14. The method of claim 1, wherein the protective material is selected from the group consisting of:

Si₃N₄, Al₂O₃, SiO₂, Cr, W, and Au.

15. The method of claim 1, wherein the protective coating protects the one or more surfaces of the microelectromechanical device against corrosion, erosion, or wear.

16. The method of claim 1, wherein the microelectromechanical device is an interferometric modulator comprising:

a substrate;

a mirror positioned over the substrate, the mirror being at least partially reflective to incident light; and

an optical layer positioned over the substrate and spaced from the minor, the optical layer being at least partially transmissive to incident light;

wherein the mixture comprises a layer between the mirror and the optical layer.

17. The method of claim 16, wherein the one or more surfaces of the interferometric modulator includes a surface of the optical layer.

18. The method of claim 16, wherein the one or more surfaces of the interferometric modulator includes a surface of the minor.

19. An interferometric modulator manufactured by the method of claim 16.

20. A microelectromechanical device manufactured by the method of claim 1.

21. A method of manufacturing a microelectromechanical device, the method comprising:

forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and

selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material,

wherein forming the composite layer comprises sputtering a composite target, the composite target comprising the sacrificial material and the protective material.

22. A method of manufacturing a microelectromechanical device, the method comprising:

forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and

selectively removing the sacrificial material, relative to the protective material, from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material,

wherein the protective coating is configured to dissipate an electrical charge between two or more components of the microelectromechanical device.

23. The method of claim 22, wherein the protective material has a dielectric constant of less than about 3.0.