MEMS device wafer-level package

• US 7,466,018 B2
• Filed: 06/04/2007
• Issued: 12/16/2008
• Est. Priority Date: 04/29/2002
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Knipe, Richard L., Strumpell, Mark H., Kocian, Thomas A.
• Primary Examiner(s): Geyer; Scott B
• Application Number:
  US11/757,546
• Publication Number:
  US 20070228540A1
• Time in Patent Office: 561 Days
• Field of Search: 257/E23.001, 257/E23.002, 257/E23.003, 257/E23.116, 257/E23.117, 257/E23.123, 257/E23.124, 257/E23.125, 257/E23.127, 257/E23.129, 257/E23.18, 257/E23.181
• US Class Current: 257/680
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 99/004 during manufacturing
• CPC Class Codes: B81C 99/0065 Process control; Yield prediction
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

Claims

1. A wafer structure for manufacturing semiconductor devices, the wafer structure comprising:

a) a semiconductor wafer comprising a plurality of dies;

b) an adhesive bead affixed to at least one of the plurality of dies;

b) a window mounted to the at least one die by the adhesive bead, wherein at least one of the plurality of dies does not have a window mounted to it.

2. The wafer structure of claim 1 wherein the adhesive bead is affixed about the perimeter of the at least one die.

3. The wafer structure of claim 2 wherein the window, the adhesive bead, and the at least one die, mounted together, form a cavity.

4. The wafer structure of claim 3 wherein the cavity is air-tight.

5. The wafer structure of claim 3 wherein the cavity is hermetic.

6. The wafer structure of claim 1 wherein the at least one die comprises a MEMS device.

7. The wafer structure of claim 1 wherein the window is transparent.

8. The method of claim 7 wherein the window comprises glass