Signal integrity self-test architecture

  • US 7,478,302 B2
  • Filed: 05/18/2004
  • Issued: 01/13/2009
  • Est. Priority Date: 05/28/2003
  • Status: Active Grant
First Claim
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1. A method of testing an integrated circuit device comprising a module, a module monitor incorporated into the module and being operable to produce a measurement signal indicative of an operating parameter of the module concerned, the method including receiving the measurement signal from the module monitor and processing that received signal to produce a test result, the operating parameter of the module concerned including one or more of temperature, cross-talk, supply noise, or matching.

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