Methods for forming layers within a MEMS device using liftoff processes to achieve a tapered edge
First Claim
1. A method of fabricating a MEMS device, comprising:
- forming an electrode layer over a substrate;
forming a sacrificial layer over the electrode layer;
patterning the sacrificial layer to form at least one tapered aperture extending through the sacrificial layer;
forming a mask layer comprising an aperture overlying the tapered aperture extending through the sacrificial layer, the mask layer comprising an overhanging portion extending around the aperture in the mask layer;
depositing a support layer over the mask layer;
removing the mask layer via a liftoff process, thereby forming a support structure located at least partially within the tapered aperture extending through the sacrificial layer; and
forming a movable layer adjacent the support structure.
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Accused Products
Abstract
Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.
269 Citations
28 Claims
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1. A method of fabricating a MEMS device, comprising:
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forming an electrode layer over a substrate; forming a sacrificial layer over the electrode layer; patterning the sacrificial layer to form at least one tapered aperture extending through the sacrificial layer; forming a mask layer comprising an aperture overlying the tapered aperture extending through the sacrificial layer, the mask layer comprising an overhanging portion extending around the aperture in the mask layer; depositing a support layer over the mask layer; removing the mask layer via a liftoff process, thereby forming a support structure located at least partially within the tapered aperture extending through the sacrificial layer; and forming a movable layer adjacent the support structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of fabricating a MEMS device, comprising:
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forming an electrode layer over a substrate; forming a mask over the electrode layer, wherein the mask comprises a negative angle extending about the periphery of the mask; depositing a layer of sacrificial material over the mask; removing the mask via a liftoff process, forming a sacrificial layer comprising a tapered aperture; forming a support structure located at least partially within the tapered aperture; and forming a movable layer adjacent the support structure. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A method of fabricating a MEMS device, comprising
forming a lower electrode layer over a substrate; -
forming a sacrificial layer over the electrode layer; forming a mask layer overlying the sacrificial layer, the mask layer comprising an aperture having an overhanging portion extending around an edge of the aperture; depositing a layer of electrode material over the mask layer; removing the mask layer via a liftoff process, thereby forming at least an isolated electrode member having an outwardly tapering edge. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification