High power radiation emitter device and heat dissipating package for electronic components

  • US 7,489,031 B2
  • Filed: 06/27/2006
  • Issued: 02/10/2009
  • Est. Priority Date: 01/31/2001
  • Status: Active Grant
  • ×
    • Pin Icon | RPX Insight
    • Pin
First Claim
Patent Images

1. A package for at least one electronic semiconductor component, said package comprising:

  • first and second substrates sealed together and spaced apart to define a sealed chamber;

    a colored liquid or colored gel contained in said sealed chamber for filtering light emitted from the sealed chamber;

    at least one electronic semiconductor component disposed in said sealed chamber in thermal contact with said colored liquid or colored gel such that heat is conducted by the sides of the sealed chamber; and

    wherein the at least one electronic semiconductor component is positioned within the sealed chamber such that light emitted from the at least one electronic component escapes the sealed chamber after passing through said colored liquid or colored gel.

View all claims
  • 0 Assignments
    ×
    ×

    Thank you for your feedback

    ×
    ×