Light-emitting device

• US 7,495,322 B2
• Filed: 05/26/2004
• Issued: 02/24/2009
• Est. Priority Date: 05/26/2003
• Status: Active Grant

• Current Assignee: Panasonic Electric Works Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Electric Works Company Limited (Panasonic Holdings Corporation)
• Inventors: Suzuki, Toshiyuki, Iwahori, Yutaka, Nishioka, Koji, Hashimoto, Takuma, Yokotani, Ryoji, Mori, Satoshi, Ishizaki, Shinya, Sugimoto, Masaru, Kimura, Hideyoshi, Uchinono, Yoshiyuki, Muto, Masahide
• Primary Examiner(s): Huynh; Andy
• Assistant Examiner(s): Khosraviani; Arman
• Application Number:
  US10/558,360
• Publication Number:
  US 20070007540A1
• Time in Patent Office: 1,735 Days
• Field of Search: 257 79-103, 257/676, 257/774, 361/414, 361/794, 361/813, 362/241, 362/294, 362/555, 438 22- 47
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17106 the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/17107 the bump connectors connecting two common bonding areas
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15156 : Side view
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 : characterized by the shape

Abstract

A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

Claims

1. A light-emitting device, comprising:

a submount comprising a mount base made of an electrically insulating material, at least one light-emitting diode chip mounted thereon and electrically conducting lines formed on the mount base to be connected electrically to the light-emitting diode chip; and

a first plate for heat transfer comprising a metallic plate,

wherein a first plane of the mount base opposed to the metallic plate of the first plate is bonded thermally to said first plate,

wherein the mount base comprises a recess, and the at least one light-emitting diode chip is mounted on a bottom of the recess,

wherein at least one groove is provided on the first plane of the mount base, and

wherein a number of said at least one groove is equal to or larger than two, the grooves have different depths, and depth of the grooves increases toward a region just below the light-emitting diode chip.

2. A light-emitting device, comprising:

a submount comprising a mount base made of an electrically insulating material, at least one light-emitting diode chip mounted thereon and electrically conducting lines formed on the mount base to be connected electrically to the light-emitting diode chip; and

a first plate for heat transfer comprising a metallic plate,

wherein a first plane of the mount base opposed to the metallic plate of the first plate is bonded thermally to said first plate,

wherein the mount base comprises a recess, and the at least one light-emitting diode chip is mounted on a bottom of the recess,

wherein at least one groove is provided on the first plane of the mount base,

wherein the light-emitting diode chip is mounted face down to the mount base with a bonding material, and said at least one groove is formed between the bonding material and the first plane of the mount base to bond thermally to the exposed portion of the metallic plate, and

wherein a number of said at least one groove is equal to or larger than two, the grooves have different depths, and depth of the grooves increases toward a region just below the bonding material.

3. A light-emitting device, comprising:

a submount comprising a mount base made of an electrically insulating material, at least one light-emitting diode chip mounted thereon and electrically conducting lines formed on the mount base to be connected electrically to the light-emitting diode chip; and

a first plate for heat transfer comprising a metallic plate,

wherein a first plane of the mount base opposed to the metallic plate of the first plate is bonded thermally to said first plate,

wherein the mount base comprises a recess, and the at least one light-emitting diode chip is mounted on a bottom of the recess,

wherein at least one groove is provided on the first plane of the mount base, and

wherein a number of the at least one light-emitting diode chip is equal to or larger than two, a number of said at least one groove is equal to or larger than two, the grooves have different depths, and said grooves have deeper depth in a region between a central light-emitting chip among the at least one light-emitting diode chip and the exposed portion of the metallic plate than in the other regions.