Multi-chip module with power system

• US 7,499,281 B2
• Filed: 01/02/2008
• Issued: 03/03/2009
• Est. Priority Date: 11/24/2004
• Status: Active Grant

• Current Assignee: Valtrus Innovations Limited (f/k/a Dolya Holdco 9 Limited) (Key Patent Innovations Limited)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Belady, Christian L., Williams, Gary W., Peterson, Eric C., Harris, Shaun L., Belson, Steven A.
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US11/968,520
• Publication Number:
  US 20080101025A1
• Time in Patent Office: 426 Days
• Field of Search: None
• US Class Current: 361/721
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB

Abstract

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Claims

1. A method, comprising:

connecting a memory and plural separate processors to a circuit board;

connecting, to form a vertically stacked configuration, a power system board to the circuit board, the power system board having plural openings;

providing a thermal dissipation device between the power system board and the circuit board;

extending a portion of the thermal dissipation device through the plural openings to conduct heat through the power system board;

dissipating heat from a surface area of the power system board with a first surface of the thermal dissipation device; and

dissipating heat from a surface area of the plural processors with a second surface of the thermal dissipation device and to the portion of the thermal dissipation device extending through the plural openings.

2. The method of claim 1 further comprising conducting heat from the surface area of the plural processors through the plural openings in the power system board to a second thermal dissipation device located above the power system board.

3. The method of claim 1 further comprising:

providing, above the power system board, a second thermal dissipation device;

conducting heat from the plural processors, through the plural openings in the power system board, and through the second thermal dissipation device;

dissipating the heat from a surface of the second thermal dissipation device.

4. The method of claim 1 further comprising:

substantially filling a volume of space between the power system board and the circuit board with the thermal dissipation device;

dissipating heat from the plural processors, through the portion of the thermal dissipation device extending through the plural openings, and to a second thermal dissipation device.

5. An electronic module, comprising:

a circuit board having plural separate processors;

a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board, the power board having plural openings; and

a thermal dissipation device disposed between the circuit board and power board, wherein the thermal dissipation device is in thermal communication with the processors and the power board and has a top surface portion extending through the plural openings of the power board and has a bottom surface portion directly above a top surface area of the processors.

6. The electronic module of claim 5 wherein the thermal dissipation device generates an airflow pathway onto the thermal dissipation device and the power board.

7. The electronic module of claim 5 wherein the thermal dissipation device dissipates heat, via a direct heat exchange, from both the power board and processors and conducts the heat through the top surface portion extending through the plural openings of the power board.

8. The electronic module of claim 5 wherein:

the electronic module has a rectangular shape;

the circuit board forms a bottom surface of the module, the power board forms a top surface of the module, and the top and bottom surfaces are parallel and spaced a distance approximately equal to a thickness of the thermal dissipation device.