Electronic device package with an integrated evaporator

• US 7,505,268 B2
• Filed: 04/05/2006
• Issued: 03/17/2009
• Est. Priority Date: 04/05/2005
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: TIR Technology LP
• Inventors: Schick, Philippe
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): PAPE, ZACHARY
• Application Number:
  US11/398,234
• Publication Number:
  US 20060261470A1
• Time in Patent Office: 1,077 Days
• Field of Search: 361/699, 361/700, 257/714, 257/99, 257/E33.057, 174/15.1, 174/252, 165/80.2, 165/80.3, 165/104.33, 362/555, 362/294, 362/373, 362/547
• US Class Current: 361/700
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/54 using thermoelectric means, e.g. Peltier elements
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.

Claims

1. An electronic device package adapted for enabling thermal regulation, said electronic device package comprising:

a housing comprising a thermally conductive substrate;

an evaporator portion adapted for operable coupling to a secondary portion of a thermal management system;

at least one electronic device disposed on the thermally conductive substrate and thermally coupled to the evaporator portion via the thermally conductive substrate; and

a carrier onto which the housing is mounted, one end of the evaporator portion extending into a hole in the carrier so as to contact the housing.

2. The electronic device package according to claim 1, wherein the substrate is a metal substrate.

3. The electronic device package according to claim 1, wherein the housing comprises electrical traces providing for electrical connection to the at least one electronic device.

4. The electronic device package according to claim 1, wherein the evaporator portion is coated with a dielectric material.

5. The electronic device package according to claim 1, wherein the thermal management system is one of a Peltier cooling device and a heat exchanger.

6. The electronic device package according to claim 1, wherein the thermal management system is one of a heat pipe and a thermosyphon.

7. The electronic device package according to claim 6, wherein the evaporator portion is configured as an evaporator for the heat pipe, said evaporator portion being hermetically coupled to the secondary portion thereby forming the heat pipe.

8. The electronic device package according to claim 7, wherein the evaporator portion and the secondary portion are hermetically sealed using a collar surrounding a mating portion of each of the evaporator portion and the secondary portion.

9. The electronic device package of claim 7, wherein the evaporator portion includes a flange for connecting the evaporator portion to a corresponding flange on the secondary portion.

10. The electronic device package according to claim 1, wherein the at least one electronic device comprises one or more light-emitting elements.

11. The electronic device package according to claim 10, wherein the one or more light-emitting elements emit light having one more colours selected from the group comprising red green, blue, amber, cyan and white.

12. The electronic device package according to claim 10, wherein the housing further comprises an optical system.

13. The electronic device package according to claim 12, wherein the optical system includes one or more of a refractive optical element, reflective optical element, diffractive optical element and encapsulation material.

14. The electronic device package according to claim 1, further comprising a sealing substance for environmentally sealing the one or more electronic devices.

15. The electronic device package according to claim 1, wherein the secondary portion has a first end and a second end and wherein the evaporator portion is operatively coupled to the first end.

16. The electronic device package according to claim 1, wherein the secondary portion has a first end and a second end and wherein the evaporator portion is operatively coupled to the secondary portion between the first end and the second end.

17. The electronic device package of claim 1, wherein the housing forms a cap for sealing one end of the evaporator portion.

18. The electronic device of claim 1, wherein the evaporator portion includes a wicking structure and an external support structure, the wicking structure being adapted to transfer a working fluid between the evaporator portion and the secondary portion.