Method of interconnecting terminals and method of mounting semiconductor devices
First Claim
1. A method of interconnecting terminals comprising:
- placing terminals so as to oppose each other with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing terminals;
heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completely cured with the opposing terminals separated from each other by a space large enough to enable the particles to move laterally inside the space, wherein in the heating, the electrically conductive particles collect between the opposing terminals by melting and agglomeration of the electrically conductive particles, and the opposing terminals are electrically interconnected; and
curing the resin component.
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Abstract
A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.
28 Citations
14 Claims
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1. A method of interconnecting terminals comprising:
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placing terminals so as to oppose each other with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing terminals; heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completely cured with the opposing terminals separated from each other by a space large enough to enable the particles to move laterally inside the space, wherein in the heating, the electrically conductive particles collect between the opposing terminals by melting and agglomeration of the electrically conductive particles, and the opposing terminals are electrically interconnected; and curing the resin component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of mounting a semiconductor device comprising:
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placing electrode pads of a semiconductor chip opposite circuit electrodes provided on a circuit substrate so as to correspond to the electrode pads with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing electrode pads and circuit electrodes; heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completely cured with the opposing electrode pads and circuit electrodes separated from each other by a space large enough to enable the particles to move laterally inside the space, wherein in the heating, the electrically conductive particles collect between the opposing electrode pads and circuit electrodes by melting and agglomeration of the electrically conductive particles, and the opposing electrode pads and circuit electrodes are electrically interconnected; and curing the resin component. - View Dependent Claims (10, 11, 12)
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13. A method of interconnecting terminals comprising:
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placing a first member having a. plurality of first terminals opposite a second member having a plurality of second terminals so that each of the first terminals opposes one of the second terminals to define a plurality of pairs of opposing terminals with an anisotropic electrically conductive resin composition including electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles completely filling a region between the first and second members which contains the pairs of opposing terminals; heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completely cured with the two terminals in each pair of opposing terminals separated from each other by a space large enough to enable the particles in the resin composition to move laterally inside the space, wherein in the heating, a plurality of the electrically conductive particles in the composition move from outside the spaces between the opposing terminals into the spaces between the opposing terminals and accumulate in the spaces together with electrically conductive particles already inside the spaces prior to the heating by melting and agglomeration of the electrically conductive particles to electrically interconnect the two opposing terminals in each of the pairs of opposing terminals; and curing the resin component. - View Dependent Claims (14)
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Specification