Method for fabricating high performance leadframe in electronic package

  • US 7,528,013 B1
  • Filed: 12/16/2004
  • Issued: 05/05/2009
  • Est. Priority Date: 11/12/2002
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • forming a leadframe comprising a single layer of an electrically conducting material, a plane die paddle, support bars on first opposite sides of an electronic package, and a plurality of leads electrically isolated from each other;

    applying metal plating to at least one of the support bars;

    mounting a semiconductor chip including signal bond pads and ground bond pads on the plane die paddle;

    connecting first wires between the signal bond pads and the plurality of leads;

    connecting second wires between the ground bond pads and the at least one of the support bars that serves as a common ground; and

    creating the electronic package that leaves the plurality of leads partially exposed at a bottom side of the electronic package providing surface mounting connections.

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