Surface mountable light emitting diode assemblies packaged for high temperature operation

CAFC
  • US 7,528,421 B2
  • Filed: 07/12/2005
  • Issued: 05/05/2009
  • Est. Priority Date: 05/05/2003
  • Status: Active Grant
First Claim
Patent Images

1. A LED assembly adapted for surface mounting and high temperature operation, the LED assembly comprising:

  • a thermally conducting base, wherein at least a portion of the thermally conducting base is substantially planar;

    one or more electrically insulating layers overlying at least a portion of the planar portion of the thermally conducting base and defining a surface cavity, wherein the electrically insulating layers include one or more terminals;

    one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the planar portion of the thermally conducting base, and electrically connected to the one or more terminals of the one or more insulating layers,wherein a bottom surface of the LED assembly includes a thermally conductive region in solderable thermal contact with the thermally conducting base, for spreading heat transmitted to the base from the one or more LED die; and

    further comprising an LED assembly mount selected from the group consisting of an electrically insulated fastener and a solderable bonding pad.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×