Active matrix type display device and method of manufacturing the same
First Claim
1. A method of manufacturing an active matrix type display device, the method comprising:
- forming active elements each corresponding to a pixel on a device forming substrate of glass;
polishing the device forming substrate to make it thinner by first performing a mechanical polishing, and then performing a chemical polishing, a thickness of the device forming substrate being 5 μ
m or more but 100 μ
m or less after polishing the device forming substrate, and a height of projections and depressions of the device forming substrate being in a range of a fiftieth to a half of the thickness;
bonding a surface of the device forming substrate, which has been polished, to a plastic substrate via an adhesion layer; and
forming a display driven by the active elements to display an image pixel by pixel, by placing a counter substrate so as to oppose to the device forming substrate.
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Accused Products
Abstract
A method of manufacturing an active matrix type display device, which is reliable and flexible, is provided. An active matrix type display device according to an aspect of the present invention includes: a first substrate, which is flexible; a thin glass layer provided on the first substrate via an adhesion layer, and having projections and depressions on a surface thereof opposing to the first substrate, the projections and depressions having rounded tips and bottoms; active elements provided on the thin glass layer, each active element corresponding to a pixel; a display provided above the thin glass layer, and driven by the active elements to display an image pixel by pixel; and a second substrate provided on the display, and having an opposing electrode formed thereon.
3 Citations
1 Claim
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1. A method of manufacturing an active matrix type display device, the method comprising:
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forming active elements each corresponding to a pixel on a device forming substrate of glass; polishing the device forming substrate to make it thinner by first performing a mechanical polishing, and then performing a chemical polishing, a thickness of the device forming substrate being 5 μ
m or more but 100 μ
m or less after polishing the device forming substrate, and a height of projections and depressions of the device forming substrate being in a range of a fiftieth to a half of the thickness;bonding a surface of the device forming substrate, which has been polished, to a plastic substrate via an adhesion layer; and forming a display driven by the active elements to display an image pixel by pixel, by placing a counter substrate so as to oppose to the device forming substrate.
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Specification