Configurations and methods for embedding electronics or light emitters in manufactured materials

• US 7,543,956 B2
• Filed: 02/28/2006
• Issued: 06/09/2009
• Est. Priority Date: 02/28/2005
• Status: Active Grant

• Current Assignee: Signify North America Corporation (Signify N.V.)
• Original Assignee: Philips Solid-State Lighting Solutions (Koninklijke Philips N.V.)
• Inventors: Piepgras, Colin, Dowling, Kevin J.
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US11/364,304
• Publication Number:
  US 20060198128A1
• Time in Patent Office: 1,197 Days
• Field of Search: 362/145, 362/147, 362/153, 362/253, 362/257, 362/311, 362/800
• US Class Current: 362/257
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: B29C 39/12 Making multilayered or multicoloured articles B29C39/021 takes precedence
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10295 Metallic connector elements partly mounted in a hole of the PCB
• CPC Class Codes: H05K 2201/10333 Individual female type metallic connector elements
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2203/308 Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/3405 Edge mounted components, e.g. terminals
• CPC Class Codes: Y10S 362/80 : Light emitting diode

Abstract

Methods and means for embedding electronic components, such as LED-based light sources and associated control circuitry, into molded or continuously cast surface materials (e.g., material manufactured under the trademark CORIAN®). During the manufacture of the surface material, the components can be held in position using a scaffold or frame constructed of a sacrificial material, the same material as the finished surface material and/or another material used in the manufacture of the finished product. The embedded components can include control circuitry, e.g., printed circuit boards, for separately controlling each component, power conductors and data busses. Conductors and/or busses can be in the form of conductive rails, wire mesh or sheets. Access to the conductors in the finished product can be made by a number of methods, including but not limited to sanding, grinding, drilling into, screwing into, and/or inserting pins into the finished material.

Claims

1. A system, comprising:

a plurality of embedded units, each embedded unit comprising at least one LED-based light source;

at least two conductive elements conductively connected to the plurality of embedded units;

a matrix of surface material surrounding the plurality of embedded units and the conductive elements such that the plurality of embedded units are embedded within the surface material;

the matrix comprising

a first module serving as a frame for supporting the plurality of embedded units and the conductive elements in a fixed position during fabrication of the matrix and having features thereon for supporting the plurality of embedded units and the conductive elements; and

a second module bonded to the first module and configured to surround the plurality of embedded units and the conductive elements; and

at least one connection mechanism configured to couple to the conductive elements at least one of power and at least one control signal for the plurality of embedded units.

2. The system of claim 1, wherein the first module and the second module comprise differing surface materials.

3. The system of claim 1, wherein at least one embedded unit of the plurality of embedded units further comprises control circuitry to facilitate operation of the at least one LED-based light source.

4. The system of claim 3, wherein the at least one embedded unit includes at least one printed circuit board (PCB) on which the control circuitry is disposed.

5. The system of claim 4, wherein at least one of the conductive elements is configured as at least one rail for supporting the at least one PCB.

6. The system of claim 5, wherein the at least one rail comprises a plurality of alternating conductive rails and insulating rails laminated together to form a single laminated structure.

7. The system of claim 5, wherein the at least one connection mechanism comprises a hollow section of the at least one rail, and wherein an interior profile of the hollow section is fabricated to mate with a connector penetrating the matrix of surface material.

8. The system of claim 5, wherein the at least one rail comprises at least two edge rails, each edge rail supporting an edge of the at least one PCB, each edge rail having a channel section, an edge of the at least one PCB mating within the channel section of the edge rail.

9. The system of claim 8, wherein the at least one rail comprises at least one third rail disposed between the at least two edge rails.

10. The system of claim 1, wherein the conductive elements comprise:

a first layer of conductive material having the plurality of embedded units mounted thereon; and

a second layer of conductive material spaced apart from said first layer, a portion of said surface material being disposed between the first and second layers.

11. The system of claim 10, wherein the at least one connection mechanism comprises:

a first conductive pin penetrating the surface material and configured to make a first electrical connection only to the first layer; and

a second conductive pin penetrating the surface material and configured to make a second electrical connection only to the second layer.

12. The system of claim 11, wherein the first conductive pin penetrates through the second layer, the first conductive pin having a non-conductive surface where it penetrates the second layer.

13. The system of claim 1, wherein the at least one connection mechanism comprises at least one conductive feed contacting the conductive elements at a location where the conductive elements are exposed by removal of a portion of the matrix of surface material.

14. The system of claim 13, wherein the at least one conductive feed comprises an internally threaded insert fixed within a bore in the matrix of surface material for mating with an externally threaded connector.

15. The system of claim 13, wherein the at least one conductive feed comprises an externally threaded connector for mating within a tapped bore in the matrix of surface material.

16. The system of claim 13, wherein the at least one conductive feed comprises a percussive projectile for penetrating into the matrix of surface material.

17. The system of claim 13, wherein the at least one conductive feed comprises a heated pin for penetrating into the matrix of surface material, the heated pin removing a portion of surface material by heating and displacing the portion of surface material.

18. The system of claim 1, wherein the at least one connection mechanism comprises at least one first coil conductively connected to the conductive elements and located within the matrix of surface material, the at least one first coil being configured to facilitate an inductive coupling to a second coil exterior to the matrix of surface material.

19. The system of claim 1, wherein the at least one connection mechanism comprises a radio frequency activated element located within the matrix of surface material and conductively connected to the conductive elements.

20. The system of claim 1, wherein the at least one connection mechanism comprises a piezoelectric element located within the matrix of surface material and conductively connected to the conductive elements.

21. The system of claim 1, wherein the at least one connection mechanism comprises a magnetic field sensitive element located within the matrix of surface material and conductively connected to the conductive elements, the magnetic field sensitive element responding to magnetic field fluctuations exterior to the matrix of surface material.

22. The system of claim 1 wherein the at least one connection mechanism comprises a photo-optical connection for optically coupling at least the at least one control signal for the plurality of embedded units.

23. The system of claim 1, wherein the at least one connection mechanism is configured to couple a multiplexed signal for providing both power and the at least one control signal to the plurality of embedded units, and where each embedded unit is configured to extract the power and the at least one control signal from the multiplexed signal.

24. The system of claim 1, wherein the at least one LED-based light source comprises:

at least one first LED configured to generate first radiation having a first spectrum; and

at least one second LED configured to generate second radiation having a second spectrum different than the first spectrum; and

each embedded unit further includes at least one controller configured to independently control a first intensity of the first radiation and a second intensity of the second radiation based at least in part on the at least one control signal.

25. A system, comprising:

a plurality of embedded units, each embedded unit comprising at least one LED-based light source;

at least two conductive elements conductively connected to the plurality of embedded units;

a matrix of surface material surrounding the plurality of embedded units and the conductive elements such that the plurality of embedded units are embedded within the surface material;

at least one connection mechanism configured to couple to the conductive elements at least one of power and at least one control signal for the plurality of embedded units; and

a frame for supporting the plurality of embedded units and the conductive elements in a fixed position during fabrication of the matrix, the frame comprising a sacrificial material absorbed into the matrix during fabrication thereof.

26. The system of claim 25, wherein the at least one LED-based light source comprises:

at least one first LED configured to generate first radiation having a first spectrum; and

at least one second LED configured to generate second radiation having a second spectrum different than the first spectrum; and

each embedded unit further includes at least one controller configured to independently control a first intensity of the first radiation and a second intensity of the second radiation based at least in part on the at least one control signal.

27. The system of claim 25, wherein at least one embedded unit of the plurality of embedded units further comprises control circuitry to facilitate operation of the at least one LED-based light source.

28. The system of claim 27, wherein the at least one embedded unit includes at least one printed circuit board (PCB) having the control circuitry disposed thereon, at least one of the conductive elements being configured as at least one rail for supporting the at least one PCB.

29. The system of claim 28, wherein the at least one rail comprises a plurality of alternating conductive rails and insulating rails laminated together to form a single laminated structure.

30. The system of claim 29, wherein the at least one connection mechanism comprises a hollow section of the at least one rail, and wherein an interior profile of the hollow section is fabricated to mate with a connector penetrating the matrix of surface material.

31. The system of claim 29, wherein the at least one rail comprises at least two edge rails, each edge rail supporting an edge of the at least one PCB, each edge rail having a channel section, an edge of the at least one PCB mating within the channel section of the edge rail.

32. The system of claim 25, wherein the conductive elements comprise:

a first layer of conductive material having the plurality of embedded units mounted thereon; and

a second layer of conductive material spaced apart from said first layer, a portion of said surface material being disposed between the first and second layers.

33. The system of claim 32, wherein the at least one connection mechanism comprises:

a first conductive pin penetrating the surface material and configured to make a first electrical connection only to the first layer; and

a second conductive pin penetrating the surface material and configured to make a second electrical connection only to the second layer.

34. The system of claim 25, wherein the at least one connection mechanism comprises at least one conductive feed contacting the conductive elements at a location where the conductive elements are exposed by removal of a portion of the matrix of surface material.

35. The system of claim 34, wherein the at least one conductive feed comprises an internally threaded insert fixed within a bore in the matrix of surface material for mating with an externally threaded connector.

36. The system of claim 34, wherein the at least one conductive feed comprises an externally threaded connector for mating within a tapped bore in the matrix of surface material.

37. The system of claim 34, wherein the at least one conductive feed comprises a percussive projectile for penetrating into the matrix of surface material.

38. The system of claim 34, wherein the at least one conductive feed comprises a heated pin for penetrating into the matrix of surface material, the heated pin removing a portion of surface material by heating and displacing the portion of surface material.

39. The system of claim 25, wherein the at least one connection mechanism comprises at least one first coil conductively connected to the conductive elements and located within the matrix of surface material, the at least one first coil being configured to facilitate an inductive coupling to a second coil exterior to the matrix of surface material.

40. The system of claim 25, wherein the at least one connection mechanism comprises a radio frequency activated element located within the matrix of surface material and conductively connected to the conductive elements.

41. The system of claim 25, wherein the at least one connection mechanism comprises a piezoelectric element located within the matrix of surface material and conductively connected to the conductive elements.

42. The system of claim 25, wherein the at least one connection mechanism comprises a magnetic field sensitive element located within the matrix of surface material and conductively connected to the conductive elements, the magnetic field sensitive element responding to magnetic field fluctuations exterior to the matrix of surface material.

43. The system of claim 25, wherein the at least one connection mechanism comprises a photo-optical connection for optically coupling at least the at least one control signal for the plurality of embedded units.

44. The system of claim 25, wherein the at least one connection mechanism is configured to couple a multiplexed signal for providing both power and the at least one control signal to the plurality of embedded units, and where each embedded unit is configured to extract the power and the at least one control signal from the multiplexed signal.