Method and system for manufacturing a wireless communication device

• US 7,546,675 B2
• Filed: 08/30/2006
• Issued: 06/16/2009
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: King, Patrick F, Forster, Ian J
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US11/468,726
• Publication Number:
  US 20070074384A1
• Time in Patent Office: 1,021 Days
• Field of Search: 296/00, 296/01, 29830-831, 29846-847, 29/250.3, 29/254.2, 298/27, 298/29, 343/700.MS, 343/767, 156/277, 156/256, 206/714, 206/716, 206/717, 831/04, 831/49, 324/768
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each of effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. A method of forming a wireless communication device, comprising:

selecting a desired capacitance value;

passing a tape, including a plurality of tabs disposed thereon, under a first roller and a second roller to selectively engage a portion of a first tab and a second tab against a substrate;

testing a capacitance of the portions of the tabs that engage the substrate;

varying the spacing between the first roller and the second roller, thereby changing the size of the portions of the tabs that engage the substrate, until the capacitance of the portions of the tabs that engage the substrate matches the desired capacitance value; and

cutting a remainder of the first tab and the second tab that are not engaged with the substrate to form antenna elements from the portions of the tabs that engage the substrate.

2. The method of claim 1, wherein at least two of the tabs are differently sized.

3. The method of claim 1, wherein the cutting the remainder of the first tab and the second tab to form antenna elements further comprises cutting a backing material.

4. The method of claim 3, further comprising adhering the backing material to the substrate.

5. The method of claim 1, further comprising placing a wireless communication chip on the substrate to put the chip in electrical communication with the antenna elements.

6. The method of claim 1, wherein the substrate has an electrical characteristic, and wherein said varying the spacing between the first roller and the second roller comprises varying the positions of the first roller and the second roller in accordance with the electrical characteristic of the substrate.

7. The method of claim 1, wherein the substrate has a dielectric constant, and wherein said varying the spacing between the first roller and the second roller comprises varying the positions of the first roller and the second roller in accordance with the dielectric constant of the substrate.

8. The method of claim 1, wherein said testing a capacitance comprises using a signal having a low level and a low frequency to test the capacitance.

9. The method of claim 8, wherein said testing a capacitance comprises using the low level signal to estimate a dielectric constant of the substrate.

10. The method of claim 1, wherein the substrate has a ground plane positioned opposite the portions of the tabs that engage the substrate, and wherein said passing the tape under the first roller and the second roller comprises passing the tape under the first roller and the second roller to selectively engage a portion of a first tab and a second tab against the substrate having a ground plane positioned opposite the portions of the tabs that engage the substrate.

11. The method of claim 1, wherein the substrate does not have a ground plane positioned opposite the portions of the tabs that engage the substrate, and wherein said passing the tape under the first roller and the second roller comprises passing the tape under the first roller and the second roller to selectively engage a portion of a first tab and a second tab against the substrate that does not have a around plane positioned opposite the portions of the tabs that engage the substrate.

12. The method of claim 1, wherein the substrate has variations in thickness corresponding to variations in the capacitance of the portions of the tabs that engage the substrate, and wherein said varying the spacing between the first roller and the second roller comprises varying the spacing between the first roller and the second roller in accordance with the variable thickness of the substrate, said thickness determined by said testing the capacitance of the portions of the tabs that engage the substrate.

13. The method of claim 1, wherein said varying the spacing between the first roller and the second roller comprises:

varying the position of the first roller, thereby changing the size of a portion of a first tab that engages the substrate;

testing the capacitance of the portions of the tabs that engage the substrate; and

varying the position of the second roller, thereby changing the size of a portion of a second tab that engages the substrate.

14. The method of claim 1, further comprising independently moving at least one of the first roller and the second roller relative to the other roller.

15. The method of claim 1, wherein said cutting the remainder of the first tab and the second tab that are not engaged with the substrate comprises cutting the remainder of the first tab and the second tab to obtain a desired impedance for the antenna elements.