Magnetic tunnel junction pressure sensors and methods
First Claim
Patent Images
1. An integrated circuit device, comprising:
- a substrate;
a first insulating layer having a magnetic tunnel junction (“
MTJ”
) core formed therein;
a second insulating layer, disposed over the first insulating layer, the second insulating layer having a conductive line disposed therein and defining a cavity therein, wherein the conductive line is configured to carry a first current that produces a first magnetic field, and wherein at least a portion of the cavity is disposed directly between the conductive line and the MTJ core and wherein a resistance value of the MTJ core varies with changes in the first magnetic field experienced by the MTJ core.
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Abstract
An integrated circuit device is provided which comprises a substrate, a conductive line configured to experience a pressure, and a magnetic tunnel junction (“MTJ”) core formed between the substrate and the current line. The conductive line is configured to move in response to the pressure, and carries a current which generates a magnetic field. The MTJ core has a resistance value which varies based on the magnetic field. The resistance of the MTJ core therefore varies with respect to changes in the pressure. The MTJ core is configured to produce an electrical output signal which varies as a function of the pressure.
27 Citations
20 Claims
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1. An integrated circuit device, comprising:
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a substrate; a first insulating layer having a magnetic tunnel junction (“
MTJ”
) core formed therein;a second insulating layer, disposed over the first insulating layer, the second insulating layer having a conductive line disposed therein and defining a cavity therein, wherein the conductive line is configured to carry a first current that produces a first magnetic field, and wherein at least a portion of the cavity is disposed directly between the conductive line and the MTJ core and wherein a resistance value of the MTJ core varies with changes in the first magnetic field experienced by the MTJ core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit device, comprising:
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an insulating layer having; a conductive line configured to carry a first current that generates a first magnetic field, wherein the conductive line moves in response to change in a pressure experienced by the conductive line; a magnetic tunnel junction (“
MTJ”
) core having a resistance value which varies as a function of the first magnetic field experienced by the MTJ core, and being configured to generate an electrical output signal which varies based on the resistance value of the MTJ core;wherein the insulating layer defines a cavity and at least a portion of the cavity is disposed directly between said conductive line and said MTJ core; and a pressure sensor circuit configured to associate a value of the electrical output signal produced by the MTJ core with a pressure value experienced by the conductive line.
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10. A pressure sensor apparatus, comprising:
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a substrate; a first insulating layer formed overlying the substrate; a magnetic tunnel junction (MTJ) core formed in the first insulating layer; a second insulating layer comprising;
a deformable diaphragm that is designed to move in response to pressure applied thereto, and a cavity defined in the second insulating layer, wherein the MTJ core is disposed below the cavity; anda programming bit line at least partially embedded in the deformable diaphragm and suspended over a portion of the cavity, wherein at least a portion of the cavity is disposed directly between the programming bit line and the MTJ core and wherein the programming bit line carries a first current that generates a first magnetic field, wherein the deformable diaphragm moves in response to pressure applied thereto such that a vertical distance between the programming bit line and the MTJ core changes with changes in the pressure applied to deformable diaphragm which changes the first magnetic field experienced by the MTJ core. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification