Method for low temperature bonding and bonded structure

  • US 7,553,744 B2
  • Filed: 10/31/2007
  • Issued: 06/30/2009
  • Est. Priority Date: 02/16/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A bonding method, comprising:

  • forming first and second bonding surfaces on first and second materials, respectively, at least one of said surfaces comprising an insulating material;

    enhancing activation of at least one of said first and second bonding surfaces;

    terminating at least one of said first and second bonding surfaces with species allowing formation of chemical bonds;

    annealing said first and second materials at a temperature of no more than about 200°

    C.; and

    forming a bond with a strength of at least 500 mJ/m2 between said first and second materials.

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