Process condition measuring device with shielding

• US 7,555,948 B2
• Filed: 05/05/2006
• Issued: 07/07/2009
• Est. Priority Date: 05/01/2006
• Status: Active Grant

• Current Assignee: SensArray Corp. (KLA Corporation)
• Original Assignee: SensArray Corp. (KLA Corporation)
• Inventors: Jensen, Earl M., Wiese, Lynn Karl
• Primary Examiner(s): Raevis; Robert R
• Application Number:
  US11/381,992
• Publication Number:
  US 20070251339A1
• Time in Patent Office: 1,159 Days
• Field of Search: None
• US Class Current: 29/592.1
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.

Claims

1. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:

forming a first substrate portion of a conductive material;

forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;

forming a second substrate portion of the conductive material;

forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;

placing an electronic circuit between the first substrate portion and the second substrate portion; and

subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad

wherein the conductive material is doped Silicon.

2. The method of claim 1 wherein, prior to forming the first contact pad, Silicon dioxide is removed from the first conductive substrate and prior to forming the second contact pad, Silicon dioxide is removed from the second conductive substrate.

3. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:

forming a first substrate portion of a conductive material;

forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;

forming a second substrate portion of the conductive material;

forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;

placing an electronic circuit between the first substrate portion and the second substrate portion; and

subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad

wherein the first substrate portion and the second substrate portion connected together, with the electronic circuit between them form an assembly that has at least one dimension that is the same as a dimension of a standard Silicon wafer and

wherein the assembly is a disk with a diameter of 150 millimeters, 200 millimeters or 300 millimeters.

4. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:

forming a first substrate portion of a conductive material;

forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;

forming a second substrate portion of the conductive material;

forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;

placing an electronic circuit between the first substrate portion and the second substrate portion; and

subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad,

wherein placing the electronic circuit between the first substrate portion and the second substrate portion includes sandwiching the electronic circuit between the first and second substrate portions such that the first contact pad faces the second contact pad.

5. The method of claim 4 wherein connecting the first substrate portion and the second substrate portion together includes bringing the first and second substrate portions together in a such a way that the first contact pad makes electrical contact with the second contact pad.

6. The method of claim 4 wherein connecting the first substrate portion and the second substrate portion together includes electrically connecting the first contact pad to the second contact pad with a conductive adhesive.

7. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:

forming a first substrate portion of a conductive material;

forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first substrate portion;

forming a second substrate portion of the conductive material;

forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the second substrate portion;

placing an electronic circuit between the first substrate portion and the second substrate portion; and

subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit between them, such that the first contact pad is electrically connected to the second pad,

wherein connecting the first substrate portion and the second substrate portion together forms a conductive shield that protects the electronic circuit against electromagnetic fields.

8. The method of claim 7 wherein the conductive material is doped Silicon.

9. The method of claim 8 wherein, prior to forming the first contact pad, Silicon dioxide is removed from the first conductive substrate and prior to forming the second contact pad, Silicon dioxide is removed from the second conductive substrate.