Multiple wavelength sensor interconnect

  • US 7,563,110 B2
  • Filed: 05/23/2008
  • Issued: 07/21/2009
  • Est. Priority Date: 03/01/2005
  • Status: Active Grant
  • ×
    • Pin
First Claim
Patent Images

1. A sensor interconnect method comprising:

  • providing a circuit substrate having an emitter mount, a detector mount and a cable connector;

    electrically connecting sensor cable wires to the cable connector; and

    decoupling the sensor cable wires from the emitter mount and the detector mount.

View all claims