Memory module and card with integrated RFID tag

• US 7,564,359 B2
• Filed: 05/03/2006
• Issued: 07/21/2009
• Est. Priority Date: 05/03/2006
• Status: Active Grant

• Current Assignee: Kingston Technology Corporation
• Original Assignee: Kingston Technology Corporation
• Inventors: Ho, John, Koh, Wei H.
• Primary Examiner(s): La; Anh V
• Application Number:
  US11/416,445
• Publication Number:
  US 20070257802A1
• Time in Patent Office: 1,175 Days
• Field of Search: 340/572.8, 340/572.7, 340/572.1, 235/492, 235/486, 342/44, 342/51, 342/42, 343/872, 343/873, 713/189, 713/150, 713/192, 713/193
• US Class Current: 340/572.8
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07732 the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks housings for electrical equipment in general, see H05K5/02
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A dual in-line memory module (DIMM) and a digital flash card are disclosed including an internal, built-in RFID tag in which identification and product information is contained. The RFID tag has an RF integrated circuit chip and antenna traces spreading outwardly therefrom to permit access to the information contained by the RF chip. In the case of a DIMM, the RF integrated circuit chip and its antenna traces are located on top of or between the layers of a multi-layer laminated printed wiring board substrate. In the case of a digital flash card, the RF integrated circuit chip and its antenna traces are preferably located on top of a multi-layer printed wiring board substrate and then encapsulated within a molded cover. In the alternative, the RF chip and its antenna traces are attached to the inside of a cover that extends over and is spaced above the printed wiring board substrate.

Claims

1. A digital memory module having an internal RFID rag, and comprising:

a multi-layer laminated substrate having a plurality of layers arranged face-to-face one another and including Dynamic Random Access Memory contact patterns surface mounted on said substrate to which DRAM memory devices are to be interconnected to receive ground, power and data signals;

an RF integrated circuit chip carried by said multi-layer laminated substrate and containing information concerning the identity and manufacture of the digital memory module, said chip embedded within said multi-layer laminated substrate and sandwiched between an adjacent pair of said plurality of layers thereof to prevent access to and tampering with said chip; and

an antenna coupled to and extending outwardly from said RE integrated circuit chip by which to enable access to the information contained thereby, said antenna also embedded within said substrate.

2. The digital memory module recited in claim 1, wherein said antenna runs between the same adjacent pair of layers of said multi-layer laminated substrate between which said RF integrated circuit chip is sandwiched.

3. A digital flash card having an internal RFIID tag, and comprising:

a printed wiring board substrate having a flash memory and a controller mounted thereon;

an RF integrated circuit chip containing information concerning the identity and manufacture of said digital flash card;

an antenna coupled to and extending outwardly from said RF integrated circuit chip by which to enable access to the information contained thereby; and

a cover attached to and extending over the top of said printed wiring board substrate so as to completely surround and enclose therewithin each one of said flash memory, said controller, said RF integrated circuit chip and said antenna to prevent access thereto and tampering therewith.

4. The digital flash card recited in claim 3, wherein said cover is filled with a molding material, such that said flash memory, said controller, said RF integrated circuit chip and said antenna are all encapsulated within said molding material.

5. The digital flash card recited in claim 3, wherein said flash card has one of a MMC, SD, CF, or PC form factor.

6. A digital flash card having an internal RFID tag, and comprising:

a multi-layer laminated substrate having a plurality of layers arranged face-to-face one another and a flash memory and a controller mounted on said substrate;

an RF integrated circuit chip containing information concerning the identity and manufacture of said digital flash card, said chip embedded within said multi-layer laminated substrate and sandwiched between an adjacent pair of said plurality of layers thereof to prevent access to and tampering with said chip; and

an antenna coupled to and extending outwardly from said RF integrated circuit chip by which to enable access to the information contained thereby, said antenna also embedded within said substrate.

7. The digital flash card recited in claim 6, wherein said antenna runs between the same adjacent pair of layers of said multi-layer laminated substrate between which said RF integrated chip is sandwiched.