Semiconductor acceleration sensor device and method for manufacturing the same

• US 7,568,390 B2
• Filed: 01/28/2005
• Issued: 08/04/2009
• Est. Priority Date: 06/18/2004
• Status: Expired due to Fees

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: Shizuno, Yoshinori
• Primary Examiner(s): Kwok; Helen C.
• Application Number:
  US11/043,997
• Publication Number:
  US 20050279166A1
• Time in Patent Office: 1,649 Days
• Field of Search: 734/93, 735/143.3, 735/143.6, 735/143.8, 735/143.4, 735/142.9, 735/141.6, 735/140.1
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Claims

1. A semiconductor acceleration sensor device comprising:

an acceleration sensor chip including;

a weight part,

a support part which flexibly supports the weight part, one end of the support part being connected to the weight part,

a pedestal part surrounding the weight part, an opposite end of the support part being connected to the pedestal part,

a stress detecting element which detects a stress from deformation caused in the support part due to an acceleration, the stress detecting element being attached to or buried in the support part;

an elastic first resin part to coat and to entirely cover the weight part and the support part;

a second resin pan to encapsulate the first resin pan and the acceleration sensor chip; and

a die pad which has a first area and a second area, and which also has an upper surface and a lower surface with the second area surrounding the first area and the pedestal part of the acceleration sensor chip being mounted on the second area.

2. The semiconductor acceleration sensor device according to claim 1 further comprising:

a through hole which is formed from the upper surface of the first area of the die pad through the lower surface of the first area of the die pad.

3. The semiconductor acceleration sensor device according to claim 2 further comprising a lid part which completely covers the through hole formed in the die pad and which is coated with the second resin part.

4. The semiconductor acceleration sensor device according to claim 2 further comprising:

a conductive part which has a first surface extending outwardly from the second resin part and which is disposed on a periphery of and spaced from the die pad; and

a wire which electrically connects the stress detecting element and the conductive part.

5. The semiconductor acceleration sensor device according to claim 1 further comprising:

a lid part attached to the acceleration sensor chip;

a substrate having a conductive part extending outwardly from the second resin part, the acceleration sensor chip being connected to the substrate via the first resin part;

a bump provided on the substrate and electrically connected to the acceleration sensor chip, the acceleration sensor chip being mounted on the bump.

6. The semiconductor acceleration sensor device according to claim 1 further comprising:

a lid part attached to the acceleration sensor chip;

a substrate having a conductive part extending outwardly from the second resin part;

a semiconductor circuit chip electrically connected to the conductive part of the substrate and mounted on the substrate, the acceleration sensor chip being connected to the semiconductor circuit chip via the first resin part;

a bump provided on the semiconductor circuit chip and electrically connected to the acceleration sensor chip, the acceleration sensor chip being mounted on the bump.