System and method for protecting micro-structure of display array using spacers in gap within display device
First Claim
1. A display package comprising:
- an array of interferometric modulators formed on a substrate;
a backplate;
a seal disposed between the substrate and the backplate, wherein the substrate, backplate, and seal together package the array of interferometric modulators; and
at least one spacer disposed above the array and between the array and the backplate, wherein at least one of the spacers prevents the backplate from contacting the array, and wherein the at least one spacer does not contact one of the backplate and the array.
3 Assignments
0 Petitions
Accused Products
Abstract
Physical forces sufficient to deform an electronic device and/or packaging for the electronic device can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device from physical damage. The packaging system for the electronic device includes one or more spacers that prevent or reduce damage to the electronic device arising from contact with the packaging. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.
186 Citations
33 Claims
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1. A display package comprising:
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an array of interferometric modulators formed on a substrate; a backplate; a seal disposed between the substrate and the backplate, wherein the substrate, backplate, and seal together package the array of interferometric modulators; and at least one spacer disposed above the array and between the array and the backplate, wherein at least one of the spacers prevents the backplate from contacting the array, and wherein the at least one spacer does not contact one of the backplate and the array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 30)
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11. A method for fabricating a display package comprising:
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providing an interferometric modulator array on a substrate; disposing one or more spacers above the array and between the array and a backplate; and sealing the backplate onto the substrate to form a display package, wherein at least one of the spacers prevents the backplate from contacting the array and wherein the one or more spacers do not contact one of the backplate and the array. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 31)
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20. A display package comprising:
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an array of interferometric modulators formed on a substrate; a backplate; a seal disposed between the substrate and the backplate, wherein the substrate, backplate, and seal together package the array of interferometric modulators; and a means for preventing the array and the backplate from contacting each other disposed above the array and between the array and the backplate, wherein the preventing means does not contact one of the modulating means and the covering means. - View Dependent Claims (21, 22, 23, 24, 25, 32)
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26. A display package manufactured by a process comprising:
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providing an interferometric modulator array on a substrate; disposing one or more spacers above the array and between the array and a backplate, wherein the one or more spacers do not contact one of the array and the backplate; and sealing the backplate onto the substrate to form a display package, wherein at least one of the spacers prevents the backplate from contacting the array. - View Dependent Claims (27, 28, 29, 33)
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Specification