Backside silicon wafer design reducing image artifacts from infrared radiation

• US 7,576,361 B2
• Filed: 08/03/2005
• Issued: 08/18/2009
• Est. Priority Date: 08/03/2005
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Inventors: Agranov, Gennadiy A., Karasev, Igor
• Primary Examiner(s): Picardat; Kevin M
• Application Number:
  US11/195,687
• Publication Number:
  US 20070031988A1
• Time in Patent Office: 1,476 Days
• Field of Search: 438/60, 438/65, 438/66, 438/72, 438/75
• US Class Current: 257/66
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20

Abstract

Imaging devices having reduced image artifacts are disclosed. The image artifacts in the imaging devices are reduced by redirecting, absorbing or scattering IR radiation that passes through the imaging device substrate away from dark pixels.

Claims

1. An imager comprising:

a semiconductor substrate having a first surface and a second surface; and

an array of pixel sensor cells comprising a plurality of pixel cells formed at a first surface of the substrate, said pixel cells including imaging pixel cells and dark current pixel cells;

wherein said second surface has surface abrasions formed therein for reducing the amount of light reflecting from said second surface back to said dark current pixel cells.

2. The imager according to claim 1, wherein said surface abrasions include perpendicular roughenings.

3. An imager comprising:

a semiconductor substrate having a first surface and a second surface; and

an array of pixel sensor cells comprising a plurality of pixel cells formed at a first surface of the substrate, said pixel cells including imaging pixel cells and dark current pixel cells;

wherein said second surface has surface abrasions that include shaped gratings formed therein for reducing the amount of light reflecting from said second surface back to said dark current pixel cells.

4. The imager according to claim 3, wherein said shaped gratings are formed at an angle of from about 10 to about 75 degrees to said second surface.

5. The imager according to claim 3, wherein said shaped gratings are formed at an angle of from about 20 to about 55 degrees to said second surface.

6. An imager comprising:

an array of pixel sensor cells comprising a plurality of active pixel cells and dark current pixel cells formed at a first surface of a substrate, wherein said active pixel cells and said dark current pixel cells are separated in said substrate by a predetermined distance, wherein the predetermined distance is such that an amount of light reflecting from a second surface of the substrate back to said dark current pixel cells is reduced.

7. The imager according to claim 6, wherein said predetermined distance is calculated by the following formula:

2·

D·

tan(α

)

where D is the thickness of said substrate and α

is the maximum angle of the infrared radiation into said substrate.

8. The imager according to claim 7, further comprising an absorption layer formed over said dark current pixel cells and said separation distance.

9. The imager according to claim 8, wherein said absorption layer is formed from materials selected from the group consisting of Ge, SiGe, and SiC.

10. The imager according to claim 8, further comprising a non-transparent layer formed over said absorption layer.

11. The imager according to claim 10, wherein said non-transparent layer is formed from a metal.

12. The imager according to claim 11, wherein said metal is selected from the group consisting of tungsten and aluminum.