Light emitting diode lighting module with improved heat dissipation structure

  • US 7,586,126 B2
  • Filed: 09/12/2006
  • Issued: 09/08/2009
  • Est. Priority Date: 07/26/2006
  • Status: Active Grant
First Claim
Patent Images

1. A light emitting diode (LED) lighting module with a heat dissipation structure, comprising:

  • a heat pipe apparatus comprising at least one heat pipe, an electrical insulation layer directly formed on a surface of the heat pipe and a circuit layer directly formed on a surface of the electrical insulation layer; and

    a plurality of LEDs directly mounted on the electrical insulation layer and electrically connected to the circuit layer.

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