Method for atmospheric pressure reactive atom plasma processing for surface modification

• US 7,591,957 B2
• Filed: 11/01/2001
• Issued: 09/22/2009
• Est. Priority Date: 01/30/2001
• Status: Expired due to Fees

• Current Assignee: Imreal Enterprises, LLC
• Original Assignee: Rapt Industries, Inc.
• Inventors: Carr, Jeffrey W.
• Primary Examiner(s): OLSEN, ALLAN W
• Application Number:
  US10/002,483
• Publication Number:
  US 20020100751A1
• Time in Patent Office: 2,882 Days
• Field of Search: 216/24, 216/38, 216/67, 156/345.39, 156/345.48, 156/345.55, 219/121.48, 219/121.51, 219/121.73, 264/1.36, 264/2.7, 264/446, 264/483, 264/600, 264/80, 264/81, 264/82
• US Class Current: 216/24
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: C03C 15/00 Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: C04B 41/53 involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete C04B41/0036 - C04B41/0054 take precedence
• CPC Class Codes: C04B 41/91 involving the removal of part of the materials of the treated articles, e.g. etching
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H05H 1/30 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/28 takes precedence
• CPC Class Codes: H05H 2245/40 Surface treatments

Abstract

Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.

Claims

1. A method for shaping an optic, comprising:

placing an optic workpiece in a plasma processing chamber including an inductively-coupled plasma (ICP) torch having an outer tube to communicate a plasma gas to a distal end of the plasma torch, a coil surrounding the distal end of the outer tube, and an inner tube nested within the outer tube to communicate a reactive precursor to the distal end;

translating at least one of the optic workpiece and the plasma torch; and

communicating the plasma gas to the distal end;

generating a plasma discharge by applying current from a radio frequency (RF) power source to the coil to excite the plasma gas, wherein a plasma sheath is formed between the distal end and the plasma discharge; and

introducing the reactive precursor to the plasma discharge through the inner tube to generate a reactive species; and

shaping the surface of the optic workpiece using the reactive species within the plasma discharge;

controlling a distribution of reactive species within the plasma discharge; and

directing the plasma discharge to a target portion of the surface of the optic workpiece.

2. The method for shaping an optic of claim 1, wherein the step of shaping the surface of the optic workpiece comprises causing minimal or no damage to the optic workpiece underneath the surface.

3. The method for shaping an optic of claim 1, wherein the step of shaping the surface of the optic workpiece comprises removing material from the surface of the optic workpiece.

4. The method for shaping an optic of claim 1, further comprising:

rotating the optic workpiece with respect to the plasma torch.

5. The method for shaping an optic of claim 1, wherein the step of the plasma discharge includes directing the reactive species to the target portion.

6. The method for shaping an optic of claim 1, further comprising:

placing the reactive precursor in a central channel of the plasma torch.

7. The method for shaping an optic of claim 1, further comprising:

using an argon gas as the plasma gas.

8. The method for shaping an optic of claim 1, further comprising:

controlling the mass flow of the reactive precursor into the plasma torch.

9. The method for shaping an optic of claim 1, further comprising:

controlling the mass flow of the reactive precursor into the plasma torch from between about 0 ml/mm to about 2,000 ml/min.

10. The method for shaping an optic of claim 1, further comprising:

controlling the mass flow of the reactive precursor into the plasma torch from between about 0 ml/min to about 50,000 ml/min.

11. The method for shaping an optic of claim 1, further comprising:

selecting a concentration of the reactive precursor to be introduced into the plasma discharge.

12. The method for shaping an optic of claim 1, further comprising:

coupling the RF energy to the plasma discharge in an annular region of the plasma torch.

13. The method for shaping an optic of claim 1, further comprising:

controlling the size of the plasma discharge by selecting the inner diameter of an outer tube of the plasma torch.

14. The method for shaping an optic of claim 1, further comprising:

communicating the plasma gas to the outer tube tangentially to form a vortex.

15. The method for shaping an optic of claim 1, further comprising:

metering the precursor and/or the plasma gas flow in the plasma torch.

16. The method for shaping an optic of claim 1, further comprising:

maintaining the temperature of the plasma torch between 5,000 and 15,000 degrees C.

17. The method for shaping an optic of claim 1, further comprising:

producing a volatile reaction product on the surface of the optic workpiece.

18. The method for shaping an optic of claim 1, further comprising:

maintaining the processing chamber at about atmospheric pressure.

19. The method for shaping an optic of claim 1, further comprising:

cleaning the surface of the optic workpiece with the plasma torch.

20. The method for shaping an optic of claim 1, further comprising:

polishing the surface of the optic workpiece with the plasma torch.

21. The method for shaping an optic of claim 1, further comprising:

planarizing the surface of the optic workpiece with the plasma torch.

22. The method for shaping an optic of claim 1, further comprising:

using a plasma torch with a multiple head to increase an etch rate of the plasma torch.

23. The method for shaping an optic of claim 1, further comprising:

using the precursor to control an etch rate of the plasma torch.

24. The method for shaping an optic of claim 23, wherein:

the precursor is any one of a solid, liquid, and gas.

25. The method for shaping an optic of claim 1, wherein the plasma torch includes an intermediate tube arranged between the outer tube and the inner tube, the method farther comprising:

introducing an auxiliary gas into the intermediate tube.

26. The method for shaping an optic of claim 25, farther comprising:

using the auxiliary gas to keep the plasma discharge away from the inner tube.

27. The method for shaping an optic of claim 25, further comprising:

using the auxiliary gas to adjust the position of the plasma discharge relative to the distal end.