Methods and apparatuses for sensing temperature of multi-via heater chips

  • US 7,594,708 B2
  • Filed: 12/30/2005
  • Issued: 09/29/2009
  • Est. Priority Date: 12/30/2005
  • Status: Active Grant
First Claim
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1. A chip for use with a printing device, comprising:

  • a plurality of ink vias arranged parallel to one another, each of the ink via having two longitudinal sides;

    a heater array disposed adjacent each longitudinal side of the ink vias such that each ink via is associated with two heater arrays disposed adjacent the two longitudinal sides of the ink via;

    a region disposed adjacent each heater array, wherein only one region is disposed between two adjacent ink vias and wherein the region disposed between two adjacent ink vias includes two heater arrays each heater array being associated with their respective ink via; and

    a single temperature sensing element disposed within each region, the temperature sensing element operable to sense a temperature representative of the heater arrays adjacent to the region and disposed at a predetermined distance away from adjacent heater arrays.

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