Methods and apparatuses for sensing temperature of multi-via heater chips

• US 7,594,708 B2
• Filed: 12/30/2005
• Issued: 09/29/2009
• Est. Priority Date: 12/30/2005
• Status: Active Grant

• Current Assignee: Slingshot Printing LLC
• Original Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Inventors: Parish, George K., Hall, Eric Spencer, Gibson, Bruce David, Barkley, Lucas David, King, David G.
• Primary Examiner(s): Nguyen; Lam S
• Application Number:
  US11/323,809
• Publication Number:
  US 20070153044A1
• Time in Patent Office: 1,369 Days
• Field of Search: 345/5, 345/9, 345/12, 345/14, 345/17, 345/19, 347/40, 347/42
• US Class Current: 347/17
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/0458 controlling heads based on heating elements forming bubbles
• CPC Class Codes: B41J 2/195 for monitoring ink quality

Abstract

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Claims

1. A chip for use with a printing device, comprising:

a plurality of ink vias arranged parallel to one another, each of the ink via having two longitudinal sides;

a heater array disposed adjacent each longitudinal side of the ink vias such that each ink via is associated with two heater arrays disposed adjacent the two longitudinal sides of the ink via;

a region disposed adjacent each heater array, wherein only one region is disposed between two adjacent ink vias and wherein the region disposed between two adjacent ink vias includes two heater arrays each heater array being associated with their respective ink via; and

a single temperature sensing element disposed within each region, the temperature sensing element operable to sense a temperature representative of the heater arrays adjacent to the region and disposed at a predetermined distance away from adjacent heater arrays.

2. The chip of claim 1, wherein the temperature sensing element comprises a temperature sensing resistor.

3. The chip of claim 2, wherein the temperature sensing element comprises a thermal sense resistor.

4. The chip of claim 3, wherein the temperature sensing element comprises an n-type implant donor thermal sensing resistor.

5. The chip of claim 1, wherein the predetermined distance is at least 300 microns.

6. The chip of claim 1, wherein the temperature sensing element is positioned substantially planar to each of the adjacent heater arrays.

7. The chip of claim 1, further comprising at least one control element operable to receive a temperature measured by the temperature sensing element.

8. The chip of claim 1, wherein the chip has at least one edge and at least one region is disposed between one of the plurality of ink vias and the at least one edge.

9. A method of fabricating chips for use with a printing device, comprising:

arranging a plurality of ink vias parallel to one another, wherein each of the ink via has two longitudinal sides;

placing a heater array adjacent each longitudinal side of the ink via such that each ink via is associated with two heater arrays placed adjacent its longitudinal sides;

defining a region adjacent each heater array such that there is only one region between two ink vias and the region between two adjacent ink vias includes arrays each heater array being associated with its respective ink via; and

positioning a single temperature sensing element disposed within each region, wherein the temperature sensing element is operable to sense a temperature representative of the heater arrays adjacent to the region and is disposed at a predetermined distance away from adjacent heater arrays.

10. The method of claim 9, wherein positioning a temperature sensing element in the region comprises positioning a temperature sensing element in substantially a center portion of the region.

11. The method of claim 9, wherein positioning a temperature sensing element in the region comprises positioning a temperature sensing resistor in the region.

12. The method of claim 9, wherein positioning a temperature sensing element in the region comprises positioning a thermal sense resistor in the region.

13. The method of claim 11, wherein positioning a temperature sensing element in the region comprises positioning an n-type implant donor thermal sensing resistor in the region.

14. The method of claim 9, wherein positioning a temperature sensing element in the region between the adjacent heater arrays comprises positioning the temperature sensing element at least 300 microns from each of the adjacent heater arrays.

15. The method of claim 9, wherein positioning a temperature sensing element in the region between the adjacent heater arrays comprises positioning the temperature sensing element substantially planar to each of the heater arrays.