Glass package that is hermetically sealed with a frit and method of fabrication

• US 7,602,121 B2
• Filed: 09/16/2005
• Issued: 10/13/2009
• Est. Priority Date: 04/16/2003
• Status: Expired due to Fees

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Streltsov, Alexander, Widjaja, Sujanto, Lamberson, Lisa A., Schroeder, Joseph F. III, Aitken, Bruce G., Morena, Robert, Miller, Richard J. II, Hagy, Henry E., Carberry, Joel P., DeMartino, Steven E.
• Primary Examiner(s): Williams; Joseph L
• Application Number:
  US11/228,803
• Publication Number:
  US 20060009109A1
• Time in Patent Office: 1,488 Days
• Field of Search: 313/512, 501/15, 501/17, 501/20, 428/426
• US Class Current: 313/512
• CPC Class Codes: C03C 27/005 with compositions containing more than 50% lead oxide by weight
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 3/072 containing boron
• CPC Class Codes: C03C 3/17 containing aluminium or beryllium
• CPC Class Codes: C03C 3/19 containing boron
• CPC Class Codes: C03C 3/21 containing titanium, zirconium, vanadium, tungsten or molybdenum
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: C03C 8/245 containing more than 50% lead oxide, by weight
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Claims

1. An organic light emitting diode device comprising:

a first glass substrate;

a second glass substrate;

an organic light emitting diode (OLED) positioned between the first and second glass substrates;

a frit positioned between the first and second glass substrates, the frit comprising a transition metal and a coefficient of expansion (CTE) lowering filler, the filler being no more than about 30% by weight of the fit; and

wherein the OLED was hermetically sealed between the first and second glass substrates with a laser that heated and softened the frit thereby forming a hermetic seal between the first and second substrates.

2. The OLED device according to claim 1 wherein the filler comprises a lithium alumino-silicate material.

3. The OLED device according to claim 1 wherein a T_g of the fit is less than about 350°

C.

4. The OLED device according to claim 1 wherein a mean particle size of the frit before the heating is less than or equal to about 10 μ

m.

5. The OLED device according to claim 1 wherein a mean particle size of the fit before the heating is between about 5 μ

m and about 10 μ

m.

6. The OLED device according to claim 1 wherein positioning the fit comprises screen printing.

7. The OLED device according to claim 1 wherein a thickness variation of the fit before the heating is between about 10 μ

m and about 15 μ

m.

8. The OLED device according to claim 1 wherein the frit is lead or cadmium free.

9. The OLED device according to claim 1 wherein the fit comprises vanadium or neodymium.

10. The method of claim 1, wherein the fit excluding the CTE lowering filler has the following composition:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-20 mole %)

ZnO (0-20 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

11. A glass package comprising:

a first glass substrate with a first coefficient of thermal expansion (CTE);

a second glass substrate with a second CTE;

a frit made from a lead free glass comprising one or more transition metals and a CTE lowering filler, the frit having a third CTE less than the first or second CTE and the filler having a mean particle size less than about 20 μ

m;

an organic layer positioned between the first and second glass substrates; and

wherein the frit was heated by an irradiation source to melt the frit and form a hermetic seal between the first and second glass plates.

12. The glass package according to claim 11 wherein the CTEs of the first and second substrates are between about 30×

10<sup>−

7</sup>/°

C. and 40×

10<sup>−

7</sup>/°

C. and the fit has a CTE that substantially matches the CTEs of said first and second substrate plates.

13. An organic light emitting diode (OLED) device comprising:

an organic light emitting diode disposed between first and second glass substrates hermetically sealed with a frit, the frit comprising one or more transition metals, a crystalline phase coefficient of thermal expansion lowering filler, and free of lead and cadmium, and wherein the frit was heated with a laser in a manner that caused the frit to melt and form a hermetic seal between the first and second glass substrates.

14. The OLED device according to claim 13 wherein a sealing temperature of the frit is such that a temperature experienced about 1 mm from the seal edge during the heating with a laser does not exceed about 100°

C. during the heating.

15. The OLED device according to claim 14 wherein a temperature of the organic light emitting diode does not exceed about 80°

C. during the heating.

16. The OLED device according to claim 13 wherein the frit comprises vanadium or neodymium.

17. The OLED device according to claim 13 wherein coefficients of thermal expansion (CTEs) of the first and second substrates are between about 30×

10<sup>−

7</sup>/°

C. and 40×

10<sup>−

7</sup>/°

C. and the frit has a CTE that substantially matches the CTEs of said first and second substrate plates.

18. The OLED device according to claim 13 wherein a T_gof the frit is less than about 350°

C.

19. An organic light emitting diode device comprising:

a first and second glass substrate suitable for use in an organic light emitting diode device;

a lead-free frit forming a hermetic seal between the first and second substrates and expansion matched thereto;

an organic light emitting diode disposed between the first and second glass substrates; and

an adhesive within a gap located between outer edges of the first and second glass substrates, wherein said gap is caused by the presence of the hermetic seal.

20. The organic light emitting diode device according to claim 19 wherein a T_g of the frit is less than about 350°

C.

21. The organic light emitting diode device according to claim 19 wherein the frit comprises a coefficient of thermal expansion (CTE) lowering filler.

22. The method according to claim 19 wherein the filler comprises no more than about 30% by weight of the fit.

23. A hermetically sealed glass package comprising:

a first glass plate;

a second glass plate;

a frit made from glass doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler positioned between the first glass plate and the second glass plate, the filler comprising no more than about 30% of the fit;

a temperature sensitive material positioned between the first and second glass plates; and

wherein the fit was heated with a laser in a manner that caused the frit to soften and form a hermetic seal between the first and second glass plates, thereby hermetically sealing the temperature sensitive material between the first and second glass plates, and wherein a temperature of the temperature sensitive material did not exceed about 100°

C. during the heating.

24. The method according to claim 23 wherein the temperature sensitive material is an organic layer.

25. The method according to claim 23 wherein the temperature sensitive material comprises an organic light emitting diode.