Method for printing an electronic circuit component on a substrate using a printing machine

• US 7,617,774 B2
• Filed: 04/29/2005
• Issued: 11/17/2009
• Est. Priority Date: 05/03/2004
• Status: Expired due to Fees

• Current Assignee: Manroland Sheetfed GmbH
• Original Assignee: Manroland AG (Allianz Se)
• Inventors: Weiss, Robert, Walther, Thomas, Dilling, Peer, Baumann, Reinhard
• Primary Examiner(s): Culler; Jill E
• Application Number:
  US11/118,725
• Publication Number:
  US 20050241506A1
• Time in Patent Office: 1,663 Days
• Field of Search: None
• US Class Current: 101/490
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0534 Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
• CPC Class Codes: H05K 2203/1563 Reversing the PCB
• CPC Class Codes: H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Abstract

A method of printing an electronic circuit or components thereof uses a printing machine to print a conductive structure on the front printing side (back side of the sheet) of a printing substrate. The sheet is then reversed and a decorative printing motif is printed on the back side in one work step. Alternatively, the circuit or components of a circuit may be printed by having a printing machine for color printing preceded by a printing machine for printing on the back side of the printing substrate. A chip is applied to the printing substrate where the back side of the printing sheet with the printing motif is cooled to prevent any negative effect on the printing motif and/or the printing substrate.

Claims

1. A method of attaching a chip to a conductive structure printed on a first side of a printing substrate, said printing substrate having a second side with a motif printed thereon, comprising:

applying cooling to the second side of the printing substrate;

while cooling is applied to the second side of the printing substrate, attaching the chip to the printed conductive structure on the first side.

2. A method according to claim 1, wherein the step of applying cooling includes pressing the second side with the printed motif against a cooled plate.

3. A method according to claim 1, wherein the step of applying cooling includes exposing the second side to cooling air.

4. A method according to claim 1, wherein the printing substrate is paper.

5. A method according to claim 1, wherein the printing substrate is a film.

6. A method of printing circuit components onto a printing substrate, comprising:

printing a conductive structure on a first side of the printing substrate, said conductive structure forming a circuit component;

printing a decorative image motif on a second side of the printing substrate, wherein the printing of the conductive structure and the printing of the decorative image motif are performed in one offset printing process; and

attaching a chip to the printed conductive structure on the first side of the printing substrate, wherein attaching the chip to the conductive structure further comprises;

applying cooling means to the second side of the printing substrate; and

while the cooling means is applied to the second side of the printing substrate, attaching the chip to the printed conductive structure on the first side.

7. A method of printing circuit components onto a printing substrate, comprising:

printing a conductive structure on a first side of the printing substrate, said conductive structure forming a circuit component;

printing a decorative image motif on a second side of the printing substrate, wherein the printing of the conductive structure and the printing of the decorative image motif are performed in one offset printing process; and

attaching a chip to the conductive structure printed on the first side of the printing substrate, wherein attaching the chip to the conductive structure further comprises;

applying cooling means to the second side of the printing substrate; and

while the cooling means is applied to the second side of the printing substrate, attaching the chip to the printed conductive structure on the first side.