Method to form a conductive device

• US 7,644,488 B2
• Filed: 05/04/2007
• Issued: 01/12/2010
• Est. Priority Date: 02/15/2001
• Status: Expired due to Fees

• Current Assignee: TAC Integral Technologies, Inc. (Balfour Beatty Plc)
• Original Assignee: TAC Integral Technologies, Inc. (Balfour Beatty Plc)
• Inventors: Aisenbrey, Thomas
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US11/800,130
• Publication Number:
  US 20070204460A1
• Time in Patent Office: 984 Days
• Field of Search: 296/021, 298/25, 336/83, 336/200
• US Class Current: 29/602.1
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49151 by deforming or shaping
• CPC Class Codes: Y10T 29/49153 with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Claims

1. A method to form a conductive device, said method comprising:

providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host;

placing a metal terminal into a mold;

thereafter, exposing said metal terminal to a magnetic field; and

injecting said mold with said conductive loaded, resin-based material to complete said device wherein said magnetic field attracts and concentrates said conductive material near said metal terminal to enhance electrical conductivity between the metal terminal and the conductive loaded, resin-based material.

2. The method according to claim 1 wherein said metal terminal maintains said magnetizing until experiencing a heat treatment.

3. The method according to claim 2 wherein said heat treatment is a soldering operation.

4. The method according to claim 1 further comprising the step of plating said metal terminal with a solderable plating prior to said step of placing said metal terminal into a mold.

5. The method according to claim 1 wherein said conductive materials comprise micron conductive fiber.

6. The method according to claim 5 wherein said micron conductive fiber is metal.

7. The method according to claim 5 wherein said micron conductive fiber is a non-conductive core with metal plating.

8. The method according to claim 5 wherein said micron conductive fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

9. The method according to claim 5 wherein said conductive materials further comprise micron conductive powder.

10. The method according to claim 1 wherein said metal terminal is a screw.

11. The method according to claim 1 wherein said metal terminal is a pin or socket.