Methods and apparatus for EMI shielding in multi-chip modules

• US 7,648,858 B2
• Filed: 06/19/2007
• Issued: 01/19/2010
• Est. Priority Date: 06/19/2007
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Tang, Jinbang, Lin, Jong-Kai
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): Khosraviani, Arman
• Application Number:
  US11/765,170
• Publication Number:
  US 20080315371A1
• Time in Patent Office: 945 Days
• Field of Search: 257/422, 257659-660, 257/701, 438/119, 438122-127
• US Class Current: 438/124
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0215 Metallic fillers
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Abstract

Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.

Claims

1. A method of manufacturing a multi-layer package structure, comprising:

providing a substrate having an adhesive layer thereon;

attaching first surfaces of a plurality of electronic components to the adhesive layer, wherein the plurality of electronic components have the first surfaces and second surfaces that are opposite the first surfaces;

forming an insulating layer with first portions disposed in contact with the second surfaces of the plurality of electronic components and with second portions disposed in contact with the adhesive layer;

forming an electrically conductive encapsulant structure over the insulating layer, resulting in a structure in which the first portions of the insulating layer are positioned between the conductive encapsulant structure and the second surfaces of the plurality of electronic components, and in which the second portions of the insulating layer are positioned between the adhesive layer and the conductive encapsulant structure;

detaching the adhesive layer from the first surfaces of the plurality of electronic components and the second portions of the insulating layer;

forming multi-layer circuitry over, and in electrical communication with, the first surfaces of the plurality of electronic components; and

forming a shielding via through the multilayer circuitry and the second portions of the insulating layer such that the shielding via directly contacts the conductive encapsulant structure.

2. The method of claim 1, further including forming a local insulating layer on the adhesive layer prior to forming the conductive encapsulant.

3. The method of claim 1, further including reducing the thickness of the conductive encapsulant layer.

4. The method of claim 1, wherein the conductive encapsulant comprises conductive plastic mold compound.

5. The method of claim 1, wherein forming the insulating layer includes depositing a polymer layer.

6. The method of claim 1, wherein forming the multilayer circuitry includes forming at least one signal via for transmitting signals between the plurality of components.

7. A method of shielding a plurality of electronic components from electromagnetic interference (EMI), wherein the plurality of electronic components have first surfaces and second surfaces that are opposite the first surfaces, comprising:

embedding the plurality of electronic components within an electrically conductive encapsulant structure such that first portions of an insulating layer are provided between the electrically conductive encapsulant structure and the second surfaces of the electronic components, and such that second portions of the insulating layer are provided between the plurality of electronic components and coplanar with the first surfaces;

forming at least one shielding via through the second portions of the insulating layer and in electrical contact with the electrically conductive encapsulant structure; and

forming multi-layer circuitry over, and in electrical communication with, the first surfaces of the plurality of electronic components, wherein the at least one shielding via directly contacts the electrically conductive encapsulant structure through the multi-layer circuitry and the second portions of the insulating layer.

8. The method of claim 7, further including forming a local insulating layer between at least one of the plurality of electronic components and the conductive encapsulant.

9. The method of claim 7, wherein forming the local shielding layer includes forming a layer of epoxy or ceramic.

10. The method of claim 7, wherein the conductive encapsulant comprises a material selected from the group consisting of aluminum, copper, nickel iron, tin, and zinc.

11. The method of claim 7, wherein the insulating layer is provided by depositing a polymer layer.

12. The method of claim 10, wherein depositing the polymer layer includes depositing a polyimide layer.